1.
double-die-turning finishing hydraulic press
双模具翻转抛光液压机
2.
Study on CMP Nano-Slurry and Technology;
CMP纳米抛光液及抛光工艺相关技术研究
3.
Chemical mechanical polishing for silicon wafer by composite abrasive slurry
利用复合磨粒抛光液的硅片化学机械抛光
4.
Study on CMP Slurry of ULSI Copper Interconnection Layer;
ULSI铜互连层CMP抛光液研究
5.
Study on CMP Slurry Prescription of SiO_2 ILD;
二氧化硅介质层CMP抛光液配方研究
6.
Study on CMP Slurry of CVD Diamond Film;
CVD金刚石膜化学机械抛光液的研制
7.
Numerical Simulation of Slurry Film Lubrication in Chemical Mechanical Polishing Process;
CMP过程中抛光液流场数值仿真研究
8.
Study on Dynamic Pressure and Temperature of Slurry in Chemical-Mechanical Polishing of Silicon Wafer
硅片化学机械抛光加工区域中抛光液动压和温度研究
9.
Influence of abrasive and chemical composition on chemo-mechanical polishing of MgO single crystal substrate
抛光液中磨料和化学成分对单晶MgO基片化学机械抛光的影响
10.
Effect of acid alkali degree on quality of super smooth surface
抛光液酸碱度对超光滑表面质量影响的研究
11.
Numerical Simulation and Experimental Research of Slurry Film Characteristic in Chemical Mechanical Polishing
CMP中抛光液膜特性的数值仿真和实验研究
12.
Development of SiO_2 ILD Chemical Mechanical Polishing Slurry and Its Performance Analysis
二氧化硅介质层CMP抛光液研制及其性能研究
13.
Preparation of the polishing solution was described.
在传统的硫酸抛光液中加入一种淡绿色的粉末晶体。
14.
Simultaneous determination of sulfamic acid and DL-malic acid in environmental friendly electropolishing solution by ion chromatography
离子色谱法同时测定环保型电镀抛光液中氨基磺酸和DL-苹果酸
15.
INFLUENCE OF POLISHING SOLUTION ON ELECTROCHEMICAL BEHAVIOR OF 304SS IN A SIMULATED PEMFC ANODE ENVIRONMENT
抛光液对304钢在模拟PEMFC阳极环境中电化学行为的影响
16.
Study on Principle of Hydrodynamic Suspension Ultra-smooth Machining and Dynamic Pressure of Polishing;
液流悬浮超光滑加工机理及抛光动压力的研究
17.
Machining Optical Glass K9 by Using Hydrodynamic Suspension Polishing Technology;
利用液流悬浮研抛技术加工光学玻璃K9的研究
18.
The Hydroforming of Square Parabolic Reflector of Auto;
矩形抛物线车灯反光镜充液拉深实验研究