1.
Study of the Reliability of Power Device with Lead-free Heat-sink Attachment;
功率器件无铅焊料焊接层可靠性研究
2.
Properties of Sn-3.0Ag-0.5Cu-xNi lead-free solders and soldering joints
Sn-3.0Ag-0.5Cu-xNi无铅焊料及焊点的性能
3.
Pb-free solders– Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、发，焊料（球、膏）发等。
4.
Pb-free solders ? Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、开发，焊料（锡球、锡膏）开发等。
5.
The Research of Sn-Zn System without Ag Lead-free Solder
新型Sn-Cu系无银无铅焊料的研究
6.
Investigation on Fabrication of a Low Melting Point Lead-free Sn-Bi-X Solders and Lead-free Soldering Process;
低熔点无铅焊料Sn-Bi-X的研制与无铅焊接工艺研究
7.
Application and Development of Surface Mount Technology;
从有铅向无铅焊接过渡阶段应注意的问题
8.
SnAgCuBi-Solder Alloy Development and Its Joint Interfacial Behavior Study;
SnAgCuBi系无铅焊料的开发及其焊点界面行为的研究
9.
Impact of Lead-Free Solder on the Result of Soldering Resistance Test
采用无铅焊料对测覆铜板耐浸焊结果的影响
10.
A: IPC is currently working to revise the specification for inspection of lead-free solder joints.
IPC正在修订关于无铅焊接的质检标准。
11.
Study on the Non-eutectic Sn-Bi Solders with Low Melting Point;
Sn-Bi系低熔点非共晶无铅焊料的研究
12.
The Microstructure and Mechanical Property of Lead-free Solder/copper Single Crystal Interface;
铜单晶体/无铅焊料的界面组织与性能
13.
The Influence with the Trace Content of Ni & Re for Sn0.7Cu Lead-Free Solder;
微量Ni、Re对Sn0.7Cu无铅焊料性能的影响
14.
Study on Indentation Creep Behavior of the Sn-Ag-Bi Lead-free Solder;
Sn-Ag-Bi无铅焊料压入蠕变性能的研究
15.
Study on Particle Reinforced Sn3.8Ag0.7Cu Composite Lead Free Solders
颗粒增强Sn3.8Ag0.7Cu复合无铅焊料的研究
16.
Selection of Solder Paste in Electronic Assembly
电子组装中无铅焊膏的选择(续完)
17.
Finite element analysis on reliability of lead-free soldered joints for CSP device
CSP器件无铅焊点可靠性的有限元分析
18.
Study of active substance for SnAgCu lead-free solder paste
SnAgCu无铅焊膏用活性物质研究