1.
Research on Influence of Milling Techniques on Tungsten-copper Composite Powder and Its Alloy;
球磨工艺对钨铜复合粉及钨铜合金影响研究
2.
Study on Plastic Deformation and Structure Properties of Sintered Dense W-Cu Composites;
烧结致密钨铜合金塑性变形及组织性能研究
3.
PERFORMANCE OF ELECTROLESS Ni-P COATING ON W-Cu ALLOY
钨铜合金表面化学镀Ni-P镀层性能研究
4.
STUDY OF MECHANICALLY ALLOYED Cu W SHAPEDCHARGE LINER MATERIALS
机械合金化铜-钨药型罩材料的研究
5.
Studies on TLP Bonding of Tungsten and Copper Alloy and Surface Metallization of Graphite;
钨与铜合金的TLP连接及石墨表面金属化研究
6.
An alloy of copper, nickel, tungsten, and zinc, formerly used in electric coils.
镍铜锌合金由铜、镍、钨和锌组成的合金，主要用来做电阻线圈
7.
Tungsten alloys are materials with a high tungsten content and low amounts of NiFe or NiCu.
钨基高比重合金是钨中加入少量的镍铁或镍铜烧结而成。
8.
Investigation of Effects of Electrical Field and Elements(Fe and Co) on the Wettability of Copper on Tungsten;
电场与合金元素Fe、Co对钨铜间润湿性的研究
9.
Natural Resources: Coal, gold, tungsten, lead, copper. uranium.
自然资源：煤、金、钨、铅、铜、铀。
10.
Properties and Structure of Ti,Mo, W Clad Diamond Tools Bonded with Copper Base Alloy
镀附钛、钼、钨金刚石与铜基合金结合剂工具的结构性能研究
11.
nitrided niobium-titanium-tungsten alloy
氧化铌--钛--钨合金
12.
Cobalt-tungsten electrodeposit as copper barrier was presented in the paper.
本文提出以电镀钴钨二元合金镀层作为防铜渗层。
13.
Meanwhile, properties of cobalt-tungsten, nickel, cobalt deposit as copper barrier at temperature between400℃ and800℃ were compared.
同时比较了在400～00℃，钴钨合金镀层与镍层、层的防铜渗能力。
14.
Results showed cobalt-tungsten deposit as copper barrier at temperature of500℃ and below was superior to nickel, cobalt deposit.
当温度低于500℃，钴钨合金镀层的防铜渗性能优于后二者。
15.
Hydrothermal Synthesis, Crystal Structure and Characterization of Copper-organonitrogen Coordinates -Polyoxotungstates;
铜—含氮有机配离子—多金属钨酸盐的水热合成、晶体结构及表征
16.
copper-graphite-bronze alloy
铜-石墨-青铜合金
17.
manganese copper
锰铜镍合金， 锰铜
18.
Reason for Gold and Copper Discovery in Mountain with Tungsten and Tin Discovery on Plain
“上山”找金铜,“下山”找钨锡及其理由