1.
Electrodeposited copper foil
GB/T5230-1995电解铜箔
2.
Study of Electrodeposits on Electrolytic Copper Foil and Electrodeposition Patterns;
电解铜箔表面电沉积镀层及沉积模型研究
3.
Persisting in advanced tech preference and strenuously developing domestic high-class electrolytic copper foils;
坚持技术优先,大力发展我国高档电解铜箔
4.
An Analysis of Electrodeposited Copper Foil Peel Strength Performance Factors & Solutions
浅析影响电解铜箔抗剥离强度的因素及对策
5.
The electrolytic copper foil production for printed circuit board in the world has experienced almost fifty years.
印制电路板用电解铜箔产品在世界上已经历了近五十年的发展历程。
6.
A review of these years in retrospect of development of electrolytic copper foil industries both at home and abroad with important events is presented in terms of production markets, technologies thereof.
本文从电解铜箔的生产、场、术等方面,记述、顾了世界及我国的发展过程和有关的重要事件。
7.
Influence of electrolytic etching currentcollector Cu foil on the performance of anode
电解刻蚀集流体铜箔对负极性能的影响
8.
porous-foil electrolytic capacitor
多孔箔片电解电容器;多孔箔片电解质电容器
9.
copper foil laminate
铜箔叠层板-印制电路板的
10.
copper clad
包铜的，铜包的，敷铜箔的
11.
Aluminium foil for electrolytic capacitor
GB/T3615-1983电解电容器用铝箔
12.
Study on Etching Process of Area-enlarging of Aluminium Foil for Electrolytic Capacitor;
电解电容器用铝箔扩面腐蚀工艺研究
13.
Phenolic cellulose paper copper-clad laminated sheets for printed circuits
GB/T4723-1992印制电路用覆铜箔酚醛纸层压板
14.
General rules for copper-clad laminated sheets for printed circuits
GB/T4721-1992印制电路用覆铜箔层压板通用规则
15.
Epoxide cellulose paper copper-clad laminated sheets for printed circuits
GB/T4724-1992印制电路用覆铜箔环氧纸层压板
16.
Test methods for copper-clad laminated sheets for printed circuits
GB/T4722-1992印制电路用覆铜箔层压板试验方法
17.
Test methods for flexible copper-clad material for printed circuits
GB/T13557-1992印制电路用挠性覆铜箔材料试验方法
18.
Flexible copper-clad polyimide film for printed circuits
GB/T13555-1992印制电路用挠性覆铜箔聚酰亚胺薄膜