1.
The Study of Sn-Ag and Sn-Zn Multi-Composition System Lead-Free Solder Alloys;
Sn-Ag和Sn-Zn系多组元无铅软钎料研究
2.
Wettability of Sn-Zn,Sn-Ag-Cu and Sn-Bi-Cu Lead-free Solder Alloys with Copper Substrate
Sn-Zn,Sn-Ag-Cu和Sn-Bi-Cu无铅焊锡合金与铜的润湿性
3.
Aging Characteristics of Pd-Ag-Sn-In-Zn Alloy
Pd-Ag-Sn-In-Zn合金时效特性
4.
Effect of Sn on the Microstructure and Properties of Ti-Zr-Nb-Sn Alloy System;
Sn元素对Ti-Zr-Nb-Sn合金系组织和性能的影响
5.
Catalytic Synthesis of Diphenyl Carbonate by Transesterification Ove Supported Sn on TiO_2 and Inorganic Sn;
TiO_2负载Sn及无机Sn催化酯交换合成碳酸二苯酯
6.
Effects of Sn content on the anticorrosion property of Ni-Sn-P alloy plating
Sn含量对Ni-Sn-P合金镀层耐腐蚀性能的影响
7.
Effect of Sn content on microstructure and phase structure of TiNbSn alloy
Sn含量对Ti-Nb-Sn合金组织及相结构的影响
8.
CROSS SECTION CHANGING GROWTH PHENOMENON OF Sn WHISKER IN Sn-3.8Ag-0.7Cu-1.0Er LEAD-FREE SOLDER
Sn-3.8Ag-0.7Cu-1.0Er无铅钎料中Sn晶须变截面生长现象
9.
The Reversibility of Liquid-liquid Structural Change of Pb-Sn、In-Sn and Pb-Bi Alloys;
温度诱导Pb-Sn、In-Sn和Pb-Bi合金液—液结构转变的可逆性
10.
Rapid Growth of Pb-Sb-Sn and Pb-Sn-Zn Ternary Eutectics under Substantial Undercooling Conditions;
深过冷条件下Pb-Sb-Sn和Pb-Sn-Zn三元共晶的生长规律研究
11.
The Effect of Melt Structure Transition on the Solidification of Binary Sn-Bi and Sn-Sb Alloys
熔体结构转变对二元Sn-Bi和Sn-Sb合金凝固的影响
12.
A Study on Hypoeutectic Sn-Zn Alloys as Lead-free Solders;
亚共晶Sn-Zn合金无铅电子焊料研究
13.
Aluminum Alloy Soldering Procedure Research Based on the Sn-Pb-Zn Solder;
基于Sn-Pb-Zn钎料铝合金钎焊工艺研究
14.
A Study of the Creep Property of Sn-9Zn Solder and Its Strengthen;
Sn-9Zn钎料蠕变性能及其复合增强研究
15.
Study on the Non-eutectic Sn-Bi Solders with Low Melting Point;
Sn-Bi系低熔点非共晶无铅焊料的研究
16.
A Study on Surface Bioactivity of NiTi and Ti-Nb-Sn Alloys;
NiTi及Ti-Nb-Sn合金表面生物活性化研究
17.
Research on Compressive Creep Bechavior of the Sn-Cu Lead-free Solder;
Sn-Cu无铅钎料压蠕变性能的研究
18.
Study on Compressive Creep Properties of the Sn-Zn Lead-free Solder;
Sn-Zn无铅钎料压蠕变行为的研究