1.
Reflow Process Simulation for BGA Package by FEA;
球栅阵列封装中回流焊工艺的有限元模拟
2.
Study on Stress-Strain and Thermal Failure of Ball Grid Array Package
球栅阵列封装的应力应变及热失效研究
3.
Integrated life prediction method of ball grid array soldered joint
球栅阵列封装焊点寿命预测的综合方法
4.
Failure Analysis of BGA Lead-free Solder Joints under Drop Impact
跌落碰撞下球栅阵列无铅焊点失效分析
5.
Robotics Ball Attachment Workcell for Ball Grid Array Semiconductor Packages;
用于集成电路球栅阵列（BGA）封装的全自动植球机的研制开发
6.
Elastic-Plastic-Creep Computational Analysis & Reliability Evaluation of Ball Grid Array Solder Joint in Cemaric Quartz Chip (CBGA);
陶瓷芯片球栅阵列（CBGA）焊点弹塑性—蠕变计算分析及可靠度评估
7.
Finite-Element Simulation and Solder Joint Life Predictions for Chip Scale Ball Grid Array Size Package;
球栅阵列尺寸封装的有限元法模拟及焊点的寿命预测分析
8.
FC-BGA Flip-Chip Ball Grid Array
反转芯片球形栅格阵列
9.
FC-PGA Flip-Chip Pin Grid Array
反转芯片针脚栅格阵列
10.
OPGA Organic Pin Grid Array
有机塑料针型栅格阵列
11.
Analysis and Design of Quasi-optical Grid Arrays Using EMF Method
准光学栅格振荡器阵列的分析与设计
12.
Silica-on-Silicon Array Waveguides Gratings;
硅基二氧化硅型阵列波导光栅的研制
13.
Studies on Low-loss Flat-field Arrayed Waveguide Grating;
低损耗平场聚焦阵列波导光栅的研究
14.
A simulation and study on Arrayed Waveguide Grating;
阵列波导光栅（AWG）的仿真与研制
15.
Characteristic Analysis of Transmission for the Arrayed Waveguide Grating Wavelength Division Multiplexer;
阵列波导光栅复用器的传输特性分析
16.
Characteristics and Analysis of Spatial Frequency Domain of Arrayed Waveguide Grating;
阵列波导光栅的空间频域特性与分析
17.
Study on Fiber Grating Sensing Array Tempreture Monitoring On-Line;
光纤光栅传感阵列温度在线监测研究
18.
Influence of crosstalk effect on grating light modulator array
交叉效应对光栅光调制器阵列的影响