1.
Phase-field Simulation of the Ternary Alloys in the Process of Non-isothermal Solidification;
三元合金非等温凝固过程的相场法模拟
2.
Phase-field Simulation of Non-isothermal Dendritic Growth of Binary Alloy;
二元合金非等温凝固枝晶生长的相场法模拟
3.
Phase-field Simulation of Influence of Solute Gradient to Process of Non-Isothermal Solidification
溶质梯度影响非等温凝固过程的相场法模拟
4.
Phase-field simulation of non-isothermal solidification dendrite growth of binary alloy under the force flow
强迫对流影响二元合金非等温凝固枝晶生长的相场法模拟
5.
Molecular dynamics simulation of liquid Cu during isothermal solidification
液态Cu等温凝固的分子动力学模拟
6.
Non-isothermal cure kinetics of V-POSS/UPR and physical properties
V-POSS/UPR非等温固化动力学与物理性能
7.
Phase-field Simulation of Isothermal Solidification of Fe-C-P Ternary Alloy;
Fe-C-P三元合金等温凝固过程相场法模拟
8.
The Simulation of Isothermal Solidification for Al-Cu Binary Alloy Based on KKS Model;
基于KKS模型Al-Cu合金等温凝固过程相场法模拟
9.
Study on the Application of Bonding Technology for Cu/Sn Isothermal Solidification in MEMS Hermetic Package;
Cu/Sn等温凝固键合在MEMS气密封装中的应用研究
10.
Phase-Field Simulation of Isothermal Solidification in Binary Alloy with Forced Convection
对流下二元合金等温凝固过程的相场模拟
11.
Direct Numerical Simulation of Non-isothermal Gas-Particle Homogeneous Isotropic Turbulence;
非等温气固两相各向同性湍流的直接数值模拟
12.
Curing Kinetics of HTPB/TDI/Al System by Non-isothermal DSC
非等温DSC研究Al/HTPB/TDI体系的固化反应动力学
13.
congelation point thermometer
测定凝固点用温度计
14.
Cu/Sn Isothermal Solidification Technology for Wafer-level Hermetic Packaging of MEMS;
Cu/Sn等温凝固键合技术在MEMS圆片级气密封装中的应用
15.
Simulate Analysis on CFRP Strengthened Reinforced Concrete Structure with FEA Method under Fire;
高温下碳纤维加固钢筋混凝土结构的非线性有限元模拟
16.
3D Non-isothermal Numerical Simulation of Automatic Pressure Gel Technology Molding Process
自动压力凝胶工艺充模过程的三维非等温数值模拟
17.
Concrete solidification temperature changes in the process of analysis
大体积混凝土凝固过程中的温度控制
18.
Nonisothermal Cure Kinetics of a High Toughness and Low Volume Shrinkage Ratio Epoxy System
非等温DSC法研究高韧性低收缩环氧体系固化动力学