1.
Moving Stiffness Analysis on the Parallel Bonding Mechanism of IC Chip Die;
IC芯片粘片机并联焊头机构的动刚度分析
2.
Design and Optimization for the Bonding Head with Parallel Mechanism Based on IC Encapsulation;
基于IC封装的并联焊头机构的设计与优化
3.
Inspection of Positioning and Moving Accuracy of the Bonding Machine of Planar Parallel Mechanism Based on Machine Vision;
基于机器视觉的并联焊头机构定位和运动精度的检测
4.
Analysis of Kinematics and Dynamics and Experimental Research for Parallel Bonder of IC Die Bonder;
IC芯片粘片机并联焊头机构的运动学动力学分析及实验研究
5.
Trajectory Planning and Motion Control Base on the IC Chip Die-bonder with Parallel Mechanism;
基于IC封装的并联焊头机构的轨迹规划及其运动控制
6.
twin-head tandem arc-welding machine
双头串联电弧自焊机
7.
Mechanism Design and Kinematics Analysis of a Parallel Manipulator for Laser Welding
一种并联激光焊接机器人的机构设计与运动学分析
8.
The Bonding Structure Optimizing Design and Experimental Study for Die Bonder;
粘片机焊头机构优化设计及实验研究
9.
Virtual Prototype of a 3_TPS (RRR) Welder Based on Pro/E
基于Pro/E的3_TPS(RRR)型并联焊机实体建模
10.
Optimize and Design for the Four-Link Structure of the Die Bonder and Motion Simulation Based on the CosmosMotion
基于CosmosMotion的焊头四连杆机构优化设计
11.
Motion Modeling and Simulation Technology of Bonding Head Mechanisms
焊头机构运动建模与仿真技术的研究
12.
Research and Development of a New Kind of Head Structure and Motion Mechanism
新型焊头结构与运动机构的研究及开发
13.
Compensating Conservation of Parallel Condenser of AC Arc Welder and Its Calculation
交流弧焊机并联电容补偿节电及其计算
14.
transverse submerged arc welding
横列双丝并联埋弧焊
15.
Research on Structure Optimization and Control Techniques of 6R Serial Arc Welding Manipulator
6R型串联弧焊机器人结构优化及其控制研究
16.
Study on Hybrid Serial-parallel Mechanisms Made of RGRR-Ⅰ
运用RGRR-Ⅰ并联机构构造混联机床的研究
17.
Characteristics of a Kind of Variable Topology Structure Parallel Mechanisms
4-TPT与其变拓扑结构并联机构的特性
18.
Synthesis of planar 2T1R non-overconstrained parallel mechanisms
平面2T1R并联机构无过约束构型设计