1.
Study on Electroless Ni-P Film Plating in Microelectronic Packaging
微电子封装中化学镀Ni-P薄膜研究
2.
Thermal-Mechanical and Hygroscopic Characteristics of Micro-electronic Packaging Polymer and Its Packaging Reliability Study;
微电子封装高聚物热、湿—机械特性及其封装可靠性研究
3.
The Recent Development of Anisotropic Conductive Adhesive Films for Microelectronic Packaging
微电子封装用各向异性导电胶膜的研究进展
4.
Research Progress in Anisotropic Conductive Adhesives for Microelectronic Packaging
微电子封装用各向异性导电胶的研究进展
5.
The Dispensing Control System and The Research of Its Performance Control for IC Packaging;
微电子封装中点胶控制系统及其性能控制研究
6.
FINITE ELEMENT IMPLEMENTATION TO TIME-DEPENDENT CONSTITUTIVE MODEL OF SOLDER IN MICRO-ELECTRONIC PACKAGING
微电子封装钎料时相关本构模型的有限元实现
7.
Surface Tension-Powered Self-assembly Mechanism and Its Applications in Microelectronic Packaging;
基于表面张力自装配机理及其在微电子封装中的应用
8.
Study on Damage Constitutive Model and Failure Mechanism of Lead-Free Solder in Microelectronic Packaging;
微电子封装中无铅焊料的损伤模型和失效机理研究
9.
Time-Dependent Damage Coupled Constitutive Model of Solder Alloy in Micro-Electronic Packaging at High Tempertaure and It's Application;
微电子封装钎料高温时相关耦合损伤本构模型及其工程应用
10.
Experimental Research and Reliability Analysis on Lead-free Solder Joints in Microelectronic Packaging
微电子封装中无铅焊点的实验研究与可靠性分析
11.
Development of Moisture Analysis Automation System for Micro-Electronic Package Based on ANSYS Workbench
基于ANSYS Workbench的微电子封装自动化湿气分析系统开发
12.
Comparison of Cu and Au Ballbonding in Microelectronics Packaging
微电子器件封装中铜与金球键合的比较(英文)
13.
SIZE EFFECT OF MECHANICAL BEHAVIOR OF MINIATURE SOLDER JOINT INTERCONNECTIONS IN ELECTRONIC PACKAGING
电子封装微互连焊点力学行为的尺寸效应
14.
electron gun vacuum lock
电子枪真空密封装置
15.
Integration and Packaging of Sensors and MEMS Devices Through Low Temperature Wafer Bonding
用低温圆片键合实现传感器和微电子机械系统器件的集成和封装
16.
Microstructure and Properties of SiCp/Cu Composites for Electronic Packaging;
电子封装用SiCp/Cu复合材料的微观组织与性能研究
17.
Improved Heat-Dissipating electrical insulator encapsulation gel By Micro-diamonds
微米金刚石对电子绝缘封装胶导热性的改进(英文)
18.
microelectronic modular assembly
微电子学微型组件装置