1.
Effect of aging on Sn-Bi lead-free solder
时效处理对Sn-Bi系无铅焊料的影响研究
2.
Study on the Non-eutectic Sn-Bi Solders with Low Melting Point;
Sn-Bi系低熔点非共晶无铅焊料的研究
3.
Low Temperature Lead-free Solder and its Developing Tendency
Sn-Bi系列低温无铅焊料及其发展趋势
4.
Study on Indentation Creep Behavior of the Sn-Ag-Bi Lead-free Solder;
Sn-Ag-Bi无铅焊料压入蠕变性能的研究
5.
The Research on Surface Modification and Wettability of Sn-Zn-Bi Lead-free Solder;
Sn-Zn-Bi无铅焊料的表面改性及润湿性研究
6.
Study on the Properties and Reliability of Sn-Zn-Bi-Cr Lead-Free Solder
Sn-Zn-Bi-Cr无铅焊料的性能与可靠性研究
7.
Investigation on Fabrication of a Low Melting Point Lead-free Sn-Bi-X Solders and Lead-free Soldering Process;
低熔点无铅焊料Sn-Bi-X的研制与无铅焊接工艺研究
8.
The Research of Sn-Zn System without Ag Lead-free Solder
新型Sn-Cu系无银无铅焊料的研究
9.
Effects of oxidation on wettability of Sn-Zn alloys
氧化对Sn-Zn系无铅焊料润湿性的影响
10.
Regression analysis for Sn-Ag-Bi-Cu lead-free solder conductive properties
Sn-Ag-Bi-Cu无铅钎料导电性能回归分析
11.
Wettability of Sn-Zn,Sn-Ag-Cu and Sn-Bi-Cu Lead-free Solder Alloys with Copper Substrate
Sn-Zn,Sn-Ag-Cu和Sn-Bi-Cu无铅焊锡合金与铜的润湿性
12.
Separation and Controlling of Intermetallic Compounds in Lead-free Sn-Ag Solders;
Sn-Ag系无铅焊料中金属间化合物的形成与控制
13.
Microstructure and properties of Sn-Zn-Bi-(P,Nd) lead-free solders
Sn-Zn-Bi-(P,Nd)无铅钎料的微观组织及性能
14.
Properties of Sn-3.0Ag-0.5Cu-xNi lead-free solders and soldering joints
Sn-3.0Ag-0.5Cu-xNi无铅焊料及焊点的性能
15.
The Study of Sn-Ag and Sn-Zn Multi-Composition System Lead-Free Solder Alloys;
Sn-Ag和Sn-Zn系多组元无铅软钎料研究
16.
A Study on Hypoeutectic Sn-Zn Alloys as Lead-free Solders;
亚共晶Sn-Zn合金无铅电子焊料研究
17.
Development of New Flux Used for Sn-9Zn Lead Free Solder;
Sn-9Zn无铅钎料助焊剂的研究
18.
A Study of New Flux for Sn-9Zn Lead-free Electronic Solders;
Sn-9Zn无铅电子钎料新型助焊剂研究