1.
New Development about Industry for IC Package Substrate in Taiwan;
发展中的台湾半导体封装用载板产业
2.
Approximate Dynamic Job-shop Scheduling Optimization for Semiconductor Assembly Based on Swarm Intelligence
半导体封装作业调度的群体智能近似动态优化
3.
Research on Modeling, Control and Implementation of Dispensing System for IC Packaging;
面向半导体封装的点胶系统建模、控制与实现
4.
The Implementation of SOP16 Product Cost Control in the FC Semiconductor Manufacturing Process;
FC半导体封装工厂SOP16的制造成本控制研究
5.
A Study on the Measurement System Analysis in Photoelectronl Semiconductor Assembly;
光电半导体封装测量系统能力分析方法研究
6.
The Researching of Algorithm for Bay-Layout in Semiconductor’s Assembly and Test Department
半导体封装测试车间隔间布局算法研究
7.
Quality Controlling of Semiconductor Assembly Based on Principal Components Analysis
基于主成分分析的半导体封装质量控制系统
8.
Assembly Process and Product Reliability Assurance System In Samsung Suzhou Semiconductor
苏州三星半导体封装工艺及产品可靠性保障体系
9.
The Research of Data Communication in Semiconductor Packaging Equipment Based on TCP/IP;
基于TCP/IP的半导体封装设备之间数据通信的研究
10.
Research & Realization of Production Management System in a Semiconductor Manufacturing;
半导体封装行业生产管理系统的应用研究与开发
11.
A survey of the AICE processes and the current fluid dispensing technology is first given.
论文首先对包括点胶技术在内的半导体封装过程的研究发展情况进行了综述。
12.
Terminology of packages for semiconductor integrated circuits
GB/T14113-1993半导体集成电路封装术语
13.
Study on the Dissipation and Packaging of High Power Laser Diode Module;
大功率半导体激光模块的散热与封装研究
14.
Power Semiconductor Devise and Packaging Advances Target Automotive Applications
面向汽车应用的功率半导体器件与封装
15.
FEA Method of High-power Semiconductor Encapsulation
大功率半导体器件封装结构的有限元分析
16.
Design and Thermal Characteristics Analysis of Uncooled 980 nm Semiconductor Laser Packaging
非制冷980nm半导体激光器封装设计与热特性分析
17.
Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits
GB/T14862-1993半导体集成电路封装结到外壳热阻测试方法
18.
Semiconductor integrated circuits--Specification for stamped lead frames of plastic DIP
GB/T14112-1993半导体集成电路塑料双列封装冲制型引线框架规范