1.
A Study on the Measurement System Analysis in Photoelectronl Semiconductor Assembly;
光电半导体封装测量系统能力分析方法研究
2.
Terminology of packages for semiconductor integrated circuits
GB/T14113-1993半导体集成电路封装术语
3.
Study on the Dissipation and Packaging of High Power Laser Diode Module;
大功率半导体激光模块的散热与封装研究
4.
Design and Thermal Characteristics Analysis of Uncooled 980 nm Semiconductor Laser Packaging
非制冷980nm半导体激光器封装设计与热特性分析
5.
Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits
GB/T14862-1993半导体集成电路封装结到外壳热阻测试方法
6.
Semiconductor integrated circuits--Specification for stamped lead frames of plastic DIP
GB/T14112-1993半导体集成电路塑料双列封装冲制型引线框架规范
7.
Study on Capacity Improvement of Semiconductor Assembly and Test Factory;
半导体集成电路封装测试工厂生产能力提升研究
8.
New Development about Industry for IC Package Substrate in Taiwan;
发展中的台湾半导体封装用载板产业
9.
semiconductor avalanche photodiode
半导体雪崩光电二极管
10.
compound-semiconductor photodiode
复合半导体光电二极管
11.
electron beam pumping semiconductor laser
电子束半导体激光器
12.
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
13.
Approximate Dynamic Job-shop Scheduling Optimization for Semiconductor Assembly Based on Swarm Intelligence
半导体封装作业调度的群体智能近似动态优化
14.
EM China covers semiconductor manufacturing, packaging, SMT, PCB and related test and measurement equipment and technology.
《电子制造》 重点关注半导体制造与封装、表面贴装技术与印刷线路板及相关的测试与测量技术，
15.
Research on Modeling, Control and Implementation of Dispensing System for IC Packaging;
面向半导体封装的点胶系统建模、控制与实现
16.
The Implementation of SOP16 Product Cost Control in the FC Semiconductor Manufacturing Process;
FC半导体封装工厂SOP16的制造成本控制研究
17.
Power Semiconductor Devise and Packaging Advances Target Automotive Applications
面向汽车应用的功率半导体器件与封装
18.
FEA Method of High-power Semiconductor Encapsulation
大功率半导体器件封装结构的有限元分析