1.
An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术
2.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
3.
The Research on a Low Cost Flip Chip Bumping Process by Stencil Printing
一种低成本倒装芯片用印刷凸焊点技术的研究
4.
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
5.
Flip Chip will be a New Method of Packaging Technology
倒装芯片将成为封装技术的最新手段
6.
Bumping Technology for MEMS Flip Chip Packaging;
MEMS封装中的倒装芯片凸点技术
7.
Research on welding fault during LED chips packaging
LED芯片封装工艺中焊接缺陷研究
8.
Flip Chip technology is a typical application.
倒装芯片技术就是其中一个典型应用。
9.
Investigation of Electromigration on Lead-Free Solder Bump in Flip Chip Packaging
倒装芯片技术中无铅凸点电迁移研究
10.
Design of a Vacuum Adsorption Dumping Gear for Flip Chip
真空吸附式倒装芯片翻转机械手设计
11.
Thermal Design of Integrated Power Electronics Module Using Flip-Chip Technology
倒装芯片集成电力电子模块的热设计
12.
Research on Fabrication Technology of Bumps for Flip Chip
用于倒装芯片的晶片凸点制作工艺研究
13.
Progress of Anisotropic Conductive Adhesive for Flip Chip Packaging
倒装芯片封装材料—各向异性导电胶的研究进展
14.
Comprehensive Comparison Between FC and CSP and Their Development Anticipation
倒装片封装与芯片规模封装的综合比较及其发展前景
15.
The Processes Parameter Controlling of Non-flow Battom Soldering Paste of the FCB Compositon
倒装芯片结构中不流动底部填充工艺参数
16.
Shear Strength of Flip Chip Packaging Bonded with Anisotropic Conductive Film
倒装芯片各向异性导电胶互连的剪切结合强度
17.
Modeling of parasitic parameters for integrated power electronics module using flip chip technology
倒装芯片集成电力电子模块寄生参数的建模
18.
Flexible Bumping Technology and Applications in MEMS Flip Chip Packaging;
MEMS器件倒装芯片封装中的柔性化凸点制备技术及其应用