1.
The stability of W_1/O emulsion in preparing polystyrene hollow microspheres by microencapsulation method
微封装法制备聚苯乙烯空心微球W_1/O乳液的稳定性
2.
EFFECT OF POTTING ON THE PACKAGING OF HIGH-G MEMS ACCELEROMETER
灌封对高量程微机械加速度计封装的影响
3.
Microsystem Technology (Serials Four)──Packaging Technologies
微系统技术（连载四）──封装技术
4.
Investigation of the Glass-ceramics Used for Anodic Bonding Material in MEMS;
MEMS封装用静电键合微晶玻璃的研究
5.
Study on Electroless Ni-P Film Plating in Microelectronic Packaging
微电子封装中化学镀Ni-P薄膜研究
6.
Thermal-Mechanical and Hygroscopic Characteristics of Micro-electronic Packaging Polymer and Its Packaging Reliability Study;
微电子封装高聚物热、湿—机械特性及其封装可靠性研究
7.
Study on Integration and Packaging of Monolithic Microwave Micro-plasma Source
单片微波微等离子体源的集成与封装研究
8.
The microcapsules are suspended in a substance similar to vegetable cooking oil.
微型封装块悬浮在像食用油那样的物质中。
9.
PACKAGING OF WAVEGUIDE DEVICES BASED ON BULK SILICON MEMS TECHNOLOGY
基于体硅微机械工艺的光波导器件封装技术
10.
STRUCTURE AND ANALYSIS OF A COMPACT DEWAR BOTTLE PACKAGE OF INFRARED DETECTOR
红外探测器封装微型杜瓦瓶结构与分析
11.
The Dispensing Control System and The Research of Its Performance Control for IC Packaging;
微电子封装中点胶控制系统及其性能控制研究
12.
Ultrasonic Bonding System Applied to the Package of Polymer Micro Parts;
应用于聚合物微器件封装的超声波键合系统
13.
Comparative Research of Micro-BGA Reliability Under Bending Stress
弯曲应力状况下微型BGA封装可靠性比较
14.
The Recent Development of Anisotropic Conductive Adhesive Films for Microelectronic Packaging
微电子封装用各向异性导电胶膜的研究进展
15.
FINITE ELEMENT IMPLEMENTATION TO TIME-DEPENDENT CONSTITUTIVE MODEL OF SOLDER IN MICRO-ELECTRONIC PACKAGING
微电子封装钎料时相关本构模型的有限元实现
16.
Comparison of Cu and Au Ballbonding in Microelectronics Packaging
微电子器件封装中铜与金球键合的比较(英文)
17.
Research Progress in Anisotropic Conductive Adhesives for Microelectronic Packaging
微电子封装用各向异性导电胶的研究进展
18.
Performance of a silicon-based embedded MMCM package
一种硅埋置型微波多芯片组件封装的电性能