1.
Research on EMI Shielding Inside Hybrid Intergrated Power Electronic Module
混合封装电力电子集成模块内电磁干扰的屏蔽
2.
Integrated power electronics module based on chip scale packaged power devices
基于芯片尺寸封装功率器件的集成电力电子模块(英文)
3.
Thermal Design of Integrated Power Electronics Module Using Flip-Chip Technology
倒装芯片集成电力电子模块的热设计
4.
Modeling of parasitic parameters for integrated power electronics module using flip chip technology
倒装芯片集成电力电子模块寄生参数的建模
5.
The Company's primary business is IC component packaging and test and memory module assembly.
公司的主要业务是集成电路封装测试和内存模块装配。
6.
hybrid microassembly
混合集成电路微组装
7.
Heat Transfer in Integrated Power Electronic Modules and in New Type of Plate-pin Fin Heat Sink;
电力电子集成模块及新型翅柱复合型散热器的传热性能研究
8.
Thick Film Integration Package Technology for Pressure Sensor
压力传感器的厚膜混合集成封装技术
9.
Research on Key Aspects in Integrated Power Electronics Modules for High Power Applications;
大功率集成化电力电子模块关键技术研究
10.
Thermal Characteristic of a Novel Flat Plate Heat Pipe for Hybrid Integrated Power Electronic Module
电力电子集成模块用平板热管的传热研究
11.
large scale hybrid integrated circuit
大规模混合集成电路
12.
package guidelines for custom hybrids
专用混合电路封装指南
13.
Flowability Analysis of the Epoxy Molding Composite used for the Packaging of Large-Scale Integrated Circuit
大规模集成电路封装用环氧树脂复合材料流动性影响分析
14.
Integration and Packaging of Sensors and MEMS Devices Through Low Temperature Wafer Bonding
用低温圆片键合实现传感器和微电子机械系统器件的集成和封装
15.
Programmable and Integrable Hybrid Optoelectronic Liquid Crystal Encoded 32 bit Full-adder Module
可编程可集成光电混合液晶编码32比特加法器模块
16.
The Design of Mixed Signals Power Management Integrated Circuit XDJ6398;
数模混合电源管理集成电路XDJ6398的设计
17.
Study on a New Al-1%Si Bonding Wire for Encapsulation of Integrate Circuit;
集成电路封装用新型Al-1%Si键合线的研制
18.
FEMMA Foldable Electronic Memory Module Assembly
折叠电子内存模块装配