1.
HLA-DRB1 and ABO Genotyping Using DNA Chip Technology;
DNA芯片技术检测HLA-DRB1和ABO基因型
2.
Clinical Study on Multi-Sites Mutation of HBV-DNA by Gene Chip;
DNA芯片技术检测HBV-DNA多点基因突变的临床研究
3.
ABO Genotyping by Duplex Amplification and Oligonucleotide Arrays Assay;
运用二重PCR和DNA芯片技术检测ABO基因型
4.
THE OVERVIEW OF MOLECULAR NUTRIOLOGY AND THE APPLICATION OF DNA CHIP TECHNOLOGY IN IT
分子营养学概述及其对DNA芯片技术的应用
5.
Application of DNA Microarray Technology in Detection of Food-Borne Pathogens
DNA芯片技术在食品病原体检测中的应用
6.
DNA Microarray-based Transcriptomics Study of Yersinia Pestis in Response to Various Conditions;
基于DNA芯片技术鼠疫耶尔森氏菌在不同条件下的转录组学研究
7.
A Microarray Approach to Identify the Differential Expression Patterns of Barley Testa Specific genes;
应用DNA芯片技术对大麦种皮特异基因的表达研究
8.
Applying the DNA Microarray to Study the Mechanism of Denucleation of K562 Cells Induced by Cytochalasin B;
应用DNA芯片技术研究细胞松弛素B诱导K562细胞脱核的分子机制
9.
Applying the DNA Microarray to Study the Mechanism of Apoptosis of K562 Cells Induced by Arsenic Trioxide;
应用DNA芯片技术研究As_2O_3诱导K562细胞凋亡的分子机制
10.
Detection and Identification of Food Borne Pathogens Using Real Time PCR and Gene Chip Assay;
运用实时荧光PCR和DNA芯片技术检测和鉴定食源性致病菌方法的研究
11.
DNA-chip-group Technology and Its Application in Solving NP Problems
DNA芯片组技术及其在解决NP问题中的应用
12.
Studies on Sample Labeling Methods of DNA Microarray and Genome Gene Expression Profiling of Rubella Virus-infected ECV304 Cells;
DNA芯片样本标记技术及风疹病毒感染ECV304细胞的基因组表达谱研究
13.
Development and optimization of DNA microarray-based Salmonella enterica serovar Typhi gene expression profiling
伤寒沙门菌基因组DNA芯片基因表达谱分析技术的建立与优化
14.
Construct cell immuno-chip with tissue microarray technique
应用组织芯片技术构建细胞免疫芯片
15.
Meanwhile, technologists are working to drive down the costs of DNA sequencing so individual human genomes can routinely be read out on gene chips.
同时，技术专家们正着手降低DNA测序成本，使个人基因组可以在基因芯片上按程序读出。
16.
Development of Whole-Genome DNA Microarray of Streptococcus suis Serotype 2 and the Platform of Gene Expression Profiling
猪链球菌2型全基因组DNA芯片的研制及基因表达谱技术平台的建立
17.
Progress in the Developments of DSM IC Technology in the 21~(st) Century
21世纪深亚微米芯片技术的新进展
18.
An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术