1.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
2.
The test chip area is 4mm~2 with 28 test pins.
芯片面积约为4平方毫米,管脚为28个(含测试管脚)。
3.
Design and Implementation of Optimizing SRAM Area in TFT IC Driver Base on DCT;
基于DCT变换的TFT驱动芯片SRAM面积优化方案设计与实现
4.
But larger chips are also more likely to contain flaws.
但体积较大的芯片更可能有瑕疵。
5.
The rapid increase in the integrated degree and dimension of chips, the more I/ O pins number, fine line pitch and miniaturization in package would result in the degradation of reliability of electronic devices.
芯片集成度的提高和大面积化，封装多针脚、引线、型化等会引起器件可靠性的下降。
6.
area of blade sectio
叶片截面面积桨叶截面面积
7.
PREPARATION OF ACTIVATED CARBON WITH HIGH SPECIFIC SURFACE AREA FROM CORN COB
玉米芯制备高比表面积活性炭的研究
8.
Studies on Negative Pressure Sampling and Sample Stacking on a Microfluidic Chip;
芯片毛细管电泳负压进样及样品堆积的研究
9.
A Design of Deinterleaver in QAM Demodulation Chip;
QAM解调芯片中卷积解交织的设计与实现
10.
Buzz sat on the floor with the memory chip in front of him.
巴兹坐在地上，将内存芯片放在前面。
11.
STUDY OF SURFACE HYDROPHILICITY MODIFICATION ON MICROFLUIDIC CHIP;
微流控芯片表面亲水性修饰技术研究
12.
ASIC design of non-uniformity correction for IRFPA
红外焦平面非均匀性校正ASIC芯片设计
13.
New method to form phosphor layer on the surface of LED chip
LED芯片表面制备荧光粉层的新方法
14.
An improved list scheduling algorithms for VLIW processor
一种面向VLIW芯片的线性指令调度算法
15.
lining area/axle
衬片摩擦面积/每轴
16.
super chip
高密度芯片,超级芯片
17.
Larger chips are faster than smaller ones because they can hold more transistors.
体积较大的芯片比较小的芯片速度快，因为它们可容纳更多的晶体管。
18.
Design on core parameters of stress-induced large-mode-area photonic crystal fiber
应力型大模面积光子晶体光纤的纤芯设计