1.
The Machine Vision System of Defect Detection for Deep-submicrometer IC;
深亚微米级IC晶片缺陷检测的机器视觉系统
2.
Research and Application of Embedded Wafer Detecting Control System by Machine Vision;
嵌入式IC晶片视觉检测系统技术研究及应用
3.
Study on Automatic Detecting Technique for the IC Wafer by Machine Vision;
IC晶片的机器视觉自动检测技术的研究
4.
Design of the Control System of the Wafer Expanding Device for IC Encapsulation
IC封装的扩晶装置控制系统的设计
5.
The Design and Implementation of RS-485 Transceiver;
RS-485通信接口芯片的IC设计与实现
6.
Design of White LED Driving IC (Front-end);
白光LED驱动电路的IC芯片设计（前端）
7.
The Design of Single-chip AC/DC Switching Power Supply Management IC;
单片AC/DC开关电源管理IC设计
8.
Mobile Telephone and Market Analysis of MMIC;
移动电话与单片微波IC的市场分析
9.
The Main Factors Causing Die Crack in IC Assembly Process
IC封装中引起芯片裂纹的主要因素
10.
On the design of the IC Card management system based on single chip microcomputer and VFP9.0
基于单片机和VFP9.0的IC卡管理系统设计
11.
The Speed Measure and Control of Handler Test Machine
IC芯片测试设备机械抓手的速度测控
12.
Moving Stiffness Analysis on the Parallel Bonding Mechanism of IC Chip Die;
IC芯片粘片机并联焊头机构的动刚度分析
13.
The Chip Design of Contactless IC Card with Logical Cipher Base on Stream Cipher;
基于流密码的非接触逻辑加密IC卡芯片设计
14.
Adaptive Inverse Control Strategy and Its Application in IC Material Slicing Equipment
自适应逆控制策略在IC材料切片设备中的应用
15.
Application of Two-Probe Spreading Resistance Technique in the Manufacturing Process of IC
二探针扩展电阻分布法在IC芯片制造中的应用
16.
Research and Realization of Image Segmentation Algorithm of IC Detection
IC芯片检测的图像分割算法研究及其实现
17.
Monocrystalline germanium slices
GB/T15713-1995锗单晶片
18.
Analysis of Kinematics and Dynamics and Experimental Research for Parallel Bonder of IC Die Bonder;
IC芯片粘片机并联焊头机构的运动学动力学分析及实验研究