1.
Theory Analysis and Experiment Research of Low Temperature Si/InP Wafer Bonding Technology;
Si/InP晶片低温键合技术的理论分析和实验研究
2.
Mechanism and Process of Cu-Sn Bonding for Wafer Level MEMS Packaging
MEMS圆片级封装用Cu-Sn低温键合机理与工艺研究
3.
Researches on Electrical and Mechanical Characteristics of Low Temperature InP/Si Wafer Bonding;
InP/Si低温晶片键合的电特性和力学特性的研究
4.
Experiments of Low Temperature Wafer Bonding and Analysis on Relevant Dynamics;
低温晶片键合的实验和动力学特性研究
5.
Study on Low Temperature Glass Frit Bonding for MEMS Device
MEMS器件封装的低温玻璃浆料键合工艺研究
6.
Integration and Packaging of Sensors and MEMS Devices Through Low Temperature Wafer Bonding
用低温圆片键合实现传感器和微电子机械系统器件的集成和封装
7.
Key Technologies on Explosion Puffing of Fruits and Vegetables at Low-Temperature and High-Pressure;
果蔬低温高压膨化干燥关键技术研究
8.
Research on Key Factor of Stable Operation for Rectisol
低温甲醇洗稳定运行的关键因素探讨
9.
Investigation of Low-Temperature Wafer Bonding and Long-Wavelength Tunable Integrated Optical Demultiplexing and Receiving Device for WDM Application;
低温晶片键合技术及长波长可调谐WDM解复用光接收集成器件的研究
10.
Study on Processing Key Technique and Quality of Low Temperature Long Term Fermentation Yogurt;
低温长时间发酵酸奶加工关键技术与品质研究
11.
Study on Key Factors Affecting Cold Storage of Tulip Bulbs;
影响郁金香种球低温贮藏关键因素的研究
12.
Analysis of key factors in low-temperature solar-thermal-electric power generation with organic Rankine cycle
太阳能有机朗肯循环低温热发电关键因素分析
13.
Cold injury of bananas in Yunxiao county
云霄县香蕉低温灾害的关键因素及其应用研究
14.
A Study on Tensile and Vacuum Fatigue of a TC4 Alloy at Cryogenic Temperature;
TC4合金低温拉伸和低温真空疲劳性能研究
15.
Mechanism of mercury speciation transformation based on combined removal at medium-to-low temperature
基于低温联合脱除的中低温Hg形态转化机理
16.
Low alloy steel plates for low temperature pressure vessels
GB3531-1996低温压力容器用低合金钢钢板
17.
Sublethal temperature might be suitable for polyploid inducement of cold shocks.
亚致死温度是低温诱导多倍体的合适温度。
18.
Synthesis of PcBN compacts with low cBN content under high pressure and high temperature
低含量PcBN复合片在高温高压下的合成