1.
Study on Mechanical Property and Solder ability of SnAgCu System Lead-free Solder Alloy
SnAgCu系无铅钎料合金力学性能及钎焊性能研究
2.
Effect of Alloying Elements and Aging on Microstructure and Solder Interface of Sn-Zn Lead-free Solders
合金元素及时效处理对Sn-Zn无铅钎料组织和钎焊界面的影响
3.
Microstructure and Solderability of Sn-Ag-Cu Lead-free Solder Powder and Alloy
Sn-Ag-Cu无铅钎料粉末与合金的组织及钎焊性能对比
4.
Effect of the Indentation Creep Property of Sn-0.7Cu Lead-free Solder Containing Alloy Elements
合金元素对Sn-0.7Cu无铅钎料压入蠕变性能的影响
5.
Effects of Pb on Properties of Sn3.5Ag0.5Cu Alloy Solder
铅对Sn3.5Ag0.5Cu合金钎料性能的影响
6.
Effect of Pb on Propert of Sn-9Zn Alloy Solder
微量铅对Sn-9Zn合金钎料性能的影响
7.
Thermomechanical Fatigue Properties of Lead-Free Solder Joints;
无铅合金钎焊接头热疲劳性能的研究
8.
Research of New Sn-Ag Based Lead-free Composite Solders Containing Nano-structured Reinforcements
纳米结构强化的新型Sn-Ag基无铅复合钎料
9.
The Study on Mixture Design of Multiplex Sn-Zn System Lead-free Solder;
多元Sn-Zn系无铅钎料混料设计的研究
10.
Research on the New Lead-Free Solder Processing Properties of Brazing and Mechanical Properties;
新型无铅钎料钎焊工艺性及机械性能的研究
11.
Research on the Properties and the Interfacial Reactions of Sn-Zn-Cu(Ni) Lead-free Solders;
Sn-Zn-Cu（Ni）无铅钎料及其钎焊接头界面反应研究
12.
Effects of different fluxes on the characteristics of Sn-Zn solders
不同钎剂对Sn-Zn系无铅钎料润湿特性的影响
13.
Composite Lead-Free Solder in Surface Mount
表面组装中Ni颗粒增强无铅复合钎料热输入研究
14.
Research on Compressive Creep Bechavior of the Sn-Cu Lead-free Solder;
Sn-Cu无铅钎料压蠕变性能的研究
15.
Study on Compressive Creep Properties of the Sn-Zn Lead-free Solder;
Sn-Zn无铅钎料压蠕变行为的研究
16.
Development of New Flux Used for Sn-9Zn Lead Free Solder;
Sn-9Zn无铅钎料助焊剂的研究
17.
A Study of New Flux for Sn-9Zn Lead-free Electronic Solders;
Sn-9Zn无铅电子钎料新型助焊剂研究
18.
The Study of Sn-Ag and Sn-Zn Multi-Composition System Lead-Free Solder Alloys;
Sn-Ag和Sn-Zn系多组元无铅软钎料研究