1.
The Influence on PCBAs Interconnect Reliability with Lead–Free Processing
无铅化组装对印制板组件互连可靠性的影响
2.
Research on the Reliability of Solder Joints in Mixed Assembly and Structure Parameter Optimization of PBGA in Lead-free Transition
无铅过渡时期混合组装PBGA焊点可靠性及封装体结构参数优化研究
3.
Selection of Solder Paste in Electronic Assembly
电子组装中无铅焊膏的选择(续完)
4.
Research development of high temperature lead-free solders for electronic assembly
电子组装用高温无铅钎料的研究进展
5.
Interfacial Evolution and Reliability of Lead-Free Solder Joints for Electronic Packaging;
电子封装中无铅焊点的界面演化和可靠性研究
6.
The Improvement and Performance Analysis of Sn-Ag-Cu Lead-Free Solder Paste;
Sn-Ag-Cu系无铅焊锡膏组成优化与性能研究
7.
Composite Lead-Free Solder in Surface Mount
表面组装中Ni颗粒增强无铅复合钎料热输入研究
8.
Formation and Evolution of the Microstructures of the Sn-Ag-Zn Solders and the Interfaces with Cu Pad
Sn-Ag-Zn系无铅焊料及其连接界面组织形成与演化规律
9.
Investigation of Electromigration on Lead-Free Solder Bump in Flip Chip Packaging
倒装芯片技术中无铅凸点电迁移研究
10.
It covers the background, solders, surface finishes, components, substrates, assembly processes, rework, and reliability of lead-free soldering.
包括背景，焊料，表面镀层，元器件，基板，组装工艺，返工和无铅焊接的可靠性。
11.
Self-assembly Synthesis、Structure and Properties of Metal Coordination Directed Organic-Inorganic (Ag、Pb) Coordination Polymer;
金属配合物导向的有机—无机（银、铅）配位聚合物的自组装合成、结构及性质表征
12.
The Aplication of the Robotic Technique in Pencil Knife Production Line;
机械手技术在铅笔刀组装线上的应用
13.
The Microstructure and Mechanical Property of Lead-free Solder/copper Single Crystal Interface;
铜单晶体/无铅焊料的界面组织与性能
14.
The Study of Sn-Ag and Sn-Zn Multi-Composition System Lead-Free Solder Alloys;
Sn-Ag和Sn-Zn系多组元无铅软钎料研究
15.
Effect of Cerium on Microstructure and Properties of Lead-free Solder Alloy
Ce对无铅焊锡合金组织及性能的影响
16.
An alloy composed of lead, tin, and zinc
铅锡锌化合物由铅、锡和锌组成的一种合金
17.
Self-Assembly and Properties of Inorganic Oxide Mesoporous Materials
无机氧化物介孔材料的自组装构筑及性能研究
18.
Interfacial Reaction and Reliability in Lead-free Electronics Packaging;
无铅电子封装中的界面反应及焊点可靠性