1.
sequentially-laminated mulitlayer
顺序层压多层印制板
2.
ALIVH multilayer printed Board
层间全内导通多层印制板
3.
Test method for insulation resistance within inner layers of multilayer printed boards
GB/T4677.17-1988多层印制板内层绝缘电阻测试方法
4.
Test method for insulation resistance between layers of multilayer printed boards
GB/T4677.18-1988多层印制板层间绝缘电阻测试方法
5.
" Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, For use in the fabrication of multilayer printed boards"
GB/T12630-1990一般用途的薄覆铜箔环氧玻璃布层压板(制造多层印制板用)
6.
Improvement of Multilayer Printed Board Quality by Relieving Residual Hot-pressing Stress
层压板热压释放残余应力对多层印制板品质的改善
7.
Planar resistor technology utilizes standard substractive processing to create integral resistors which are incorpo rated on the internal planes of multilayer PCBs.
平面电阻技术采用常规的印制板减成法生产工艺，将电阻集成于多层印制板内。
8.
Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
GB/T12629-1990限定燃烧性的薄覆铜箔环氧玻璃布层压板(制造多层印制板用)
9.
Specialize manufactured double sided and multilayer PCB from 1986.
简介：成立于1986年，是生产双面和多层印制板的专业公司。
10.
Study on the Processing Technology of the Step Designed Planar Buried Resistant Microwave Multilayer Printed Circuit Board
埋电阻台阶式多层微波印制板制造技术研究
11.
interlayer contact
层间接触-印制电路板的
12.
interlayer continuity
层间连接-印制电路板的
13.
copper foil laminate
铜箔叠层板-印制电路板的
14.
Test method of surface insulation resistance for printed boards
GB/T4677.1-1984印制板表层绝缘电阻测试方法
15.
Test methods for voltage proof of surface layers on printed boards
GB/T7613.2-1987印制板表层耐电压试验方法
16.
multilayer and high density fine-pitch printed circuit board
多层和高密度细线距的印刷电路板；多层和高密度细线距的线路板
17.
Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
GB/T16317-1996多层印制电路用限定燃烧性的薄覆铜箔聚酰亚胺玻璃布层压板
18.
Low Cost Printed Flexible Multilayer Substrates
多层柔性衬底电路板的低成本丝网印刷