1.
Study on Production of Free-Lead Solder Alloy and Solder Alloy Fine Powder of Sn-Ag-Cu System;
Sn-Ag-Cu系无铅焊锡合金及其微粉制备技术研究
2.
The Improvement and Performance Analysis of Sn-Ag-Cu Lead-Free Solder Paste;
Sn-Ag-Cu系无铅焊锡膏组成优化与性能研究
3.
Research on Properties of Sn-Ag-Cu Solder Alloy Doped with Sb;
掺杂Sb的Sn-Ag-Cu系焊料合金性能的研究
4.
Wettability of Sn-Zn,Sn-Ag-Cu and Sn-Bi-Cu Lead-free Solder Alloys with Copper Substrate
Sn-Zn,Sn-Ag-Cu和Sn-Bi-Cu无铅焊锡合金与铜的润湿性
5.
Ag-Cu-Sn Compound Electronic Support Material
Ag-Cu-Sn复合电子支架功能材料
6.
Regression analysis for Sn-Ag-Bi-Cu lead-free solder conductive properties
Sn-Ag-Bi-Cu无铅钎料导电性能回归分析
7.
The Study of Sn-Ag and Sn-Zn Multi-Composition System Lead-Free Solder Alloys;
Sn-Ag和Sn-Zn系多组元无铅软钎料研究
8.
Research on Electroplating Techonology and Mechanism of Sn-Ag-Cu Alloy Coatings;
电沉积Sn-Ag-Cu合金工艺及沉积机理研究
9.
MODELING OF Ag_3Sn COARSENING AND ITS EFFECT ON CREEP IN Sn-Ag-Cu SOLDER
Ag_3Sn粗化模型及其对Sn-Ag-Cu焊料蠕变的影响
10.
Studies about superconductor of Y-Ba-Cu-O compound system covered with Ag or Cu;
Y-Ba-Cu-O系Ag、Cu包套超导体的研制
11.
Determination of Be,B,Pb,Cu,Ag,Mo,Sn and Zn in the geological samples by deep hole electrode emission spectrography
深孔电极发射光谱法测定地质样品中Be、B、Pb、Mo、Sn、Cu、Ag、Zn
12.
Microstructure and Solderability of Sn-Ag-Cu Lead-free Solder Powder and Alloy
Sn-Ag-Cu无铅钎料粉末与合金的组织及钎焊性能对比
13.
Effect of Ag and Ni on melting temperature and spreadability of Sn-SbCu solder alloy
Ag和Ni元素对Sn-Sb-Cu无铅钎料熔化温度和铺展性能的影响
14.
The Research of Sn-Zn System without Ag Lead-free Solder
新型Sn-Cu系无银无铅焊料的研究
15.
Separation and Controlling of Intermetallic Compounds in Lead-free Sn-Ag Solders;
Sn-Ag系无铅焊料中金属间化合物的形成与控制
16.
Studies on Mixing Ag in the Superconductor of Y-Ba-Cu-O Compound System;
Y-Ba-Cu-O系超导体Ag掺杂的研究
17.
Study on Cu-Ag-Si-Ga Series Brazing Filler Alloys with Low Vapour Pressure
Cu-Ag-Si-Ga系低蒸气压钎料合金研究
18.
Study on Heteroepitaxial Growth of Au/Cu,Ag/Cu and Cu/Au System by Molecular Dynamics Dynamics Simulation;
Au/Cu、Ag/Cu及Cu/Au体系异质外延生长的分子动力学研究