1.
Preparation of Ti-Si Eutectic Brazes and its Weldability to SiC
Ti-Si共晶钎料的制备及其对SiC陶瓷可焊性
2.
Wetting kinetics of Sn-Pb eutectic solder on Cu and Cu-Sn intermetallics substrates
Sn-Pb共晶钎料在铜基板及金属间化合物基板上的润湿动力学
3.
Properties of Sn-0.65CuX modified hypoeutectic solder in nelting state
Sn-0.65CuX亚共晶改性钎料的液态性能
4.
eutectic vibration brazing
共晶合金振动钎焊法
5.
The Research on Properties and Bonding Mechanism of Armorphous Cu-P Filler Metals;
非晶Cu-P钎料的性能及钎焊机理研究
6.
Bonding process of pure copper with amorphous Cu-P interlayer
非晶Cu-P钎料钎焊接头形成过程
7.
Characteristics of Amorphous Brazing Ribbon of Cu-P Based Alloy
非晶态铜磷钎料真空钎焊紫铜的性能
8.
Study on Brazing of Cemented Carbide to Steel Using Cu-Based Microcrystalline Brazing Alloy Foils;
基于Cu基微晶钎料的硬质合金/钢钎焊试验研究
9.
Microstructure and Mechanical Property of Joint by Amorphous Fillers
非晶镍基钎料钎焊接头性能及微观组织的研究
10.
Microstructure Transformation during Ramp-up of Weld in Brazing Copper with Cu-P Amorphous Fillers
非晶铜磷钎料升温过程中的组织演变
11.
The Study on Structural Transition and Diffusing Behaviour of Amorphous Cu-P Filler Metals;
非晶Cu-P钎料钎焊过程的组织转变及扩散行为研究
12.
Morphologies and characteristics of tin whiskers on surface of SnAgCuCe/Er lead-free solder
SnAgCuCe/Er无铅钎料表面锡晶须的形态及特性
13.
CROSS SECTION CHANGING GROWTH PHENOMENON OF Sn WHISKER IN Sn-3.8Ag-0.7Cu-1.0Er LEAD-FREE SOLDER
Sn-3.8Ag-0.7Cu-1.0Er无铅钎料中Sn晶须变截面生长现象
14.
Study on the new type soldering acid and filler metal for restoration of ancient bronze;
古代青铜器修复钎焊用钎剂与钎料的改性研究
15.
Aluminum Alloy Soldering Procedure Research Based on the Sn-Pb-Zn Solder;
基于Sn-Pb-Zn钎料铝合金钎焊工艺研究
16.
Ti-25Cu-25Zr Filler Metal and Pure Titanium Brazed Process
Ti-25Cu-25Zr钎料与纯钛的钎焊工艺
17.
A Study on the Active Brazing of AlN to W-Cu Alloy with Ag-Ti_4 Active Filler Alloy
Ag-Ti_4活性钎料钎焊AlN与W-Cu合金研究
18.
Study on Processing Technology and Brazing Performance of Ag55Cu21Zn17Sn5Ge2 Solder
Ag55Cu21Zn17Sn5Ge2钎料加工工艺及其钎焊性能的研究