1.
Development of 64-route Thick Film Hybrid Integrated Switching Module;
64路厚膜混合集成开关模块的研制
2.
The Reliability-Analysis for HIC and Its Improvement;
厚膜混合集成电路可靠性分析与提高
3.
Thick Film Integration Package Technology for Pressure Sensor
压力传感器的厚膜混合集成封装技术
4.
Research on Thick-film Integrated Technology of Digital Accelerometer;
数字式加速度传感器的厚膜混合集成技术研究
5.
Application of Virtual Instruments Technique in HIC Testing;
虚拟仪器技术在厚膜混合集成电路测试中应用
6.
Thick-film hybrid integrated capacitive accelerometer
基于厚膜混合集成的电容式加速度传感器
7.
The Application of Infrared Imaging Technology on The Thermal Design of Thick Film Hybrid IC
热成像技术在厚膜混合集成电路热设计中的应用
8.
Research on Thick Film Hybrid Integration Fabrication and Program of Micromechanical Accelerometer;
硅微加速度传感器厚膜混合集成方案与工艺研究
9.
circuit, integrated hybrid, thin or thick film
混合集成电路,薄膜或厚膜的
10.
passive hybrid film integrated circuit
无源混合膜集成电路
11.
Generic specification for film integrated circuits and hybrid film integrated circuits
GB/T8976-1996膜集成电路和混合膜集成电路总规范
12.
Case outlines for film integrated circuits and hybrid integrated circuits
GB/T15138-1994膜集成电路和混合集成电路外形尺寸
13.
Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure
GB/T13062-1991膜集成电路和混合膜集成电路空白详细规范(可供认证用)
14.
Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
GB/T16465-1996膜集成电路和混合膜集成电路分规范（采用能力批准程序）
15.
Design of Hybrid Mental Iris Filter Based on Substrate Integrate Waveguide(SIW)
基片集成波导混合金属膜片滤波器的设计
16.
Important Technique Problems in Silk Screen Printing for Thick Film Integrated Circuits
厚膜集成电路网印应注意的技术问题
17.
Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
GB/T16466-1996膜集成电路和混合膜集成电路空白详细规范(采用能力批准程序)
18.
Research on Influence of Thickness of Asphaltum to the Performance of Asphaltum Mixture;
沥青膜厚度对沥青混合料性能影响的研究