1.
Study on Transmission Laser Bonding and Its Parallel Micro Manipulation;
激光穿透键合机理及其并联微操作平台的研究
2.
Mechanism and Process of Cu-Sn Bonding for Wafer Level MEMS Packaging
MEMS圆片级封装用Cu-Sn低温键合机理与工艺研究
3.
Investigation on the Mechanism and Microstructure and Mechanical Properties of the Anodic Bonding for the Pyrex Glass to Metals;
Pyrex玻璃与金属阳极键合机理及界面结构和力学性能的分析
4.
Simulation and Experiments Research on the Ultrasonic Bonding Mechanism of Microfluidic Chips;
塑料微流控芯片超声波键合机理的仿真与实验研究
5.
Microstructure and mechanisms of the interface between borosilicate glass and silicon by anodic bonding
硼硅玻璃与硅阳极键合机理及其界面微观结构分析
6.
Reason3: A slide phone with a broad keypad that fits well with your hand.
理由3：手机为滑盖式，键盘宽大，非常适合你的手。
7.
Reasonable cavity shape of crusher guarantees effective operation of crusher.
合理的破碎腔形是保证破碎机有效工作的关键。
8.
The Structure and Bonding Linkage Mechanism of the Calcium Silicate Hydrates Contained the Organic Complex Molecule;
掺杂有机大分子水化硅酸钙的结构及键合原理
9.
Microcosmic Mechanism and Rule of the Interfaces in Ultrasonic Bonding;
超声键合界面微结构生成机理与规律研究
10.
A stroke of a key, as on a word processor.
按键（如在文字处理机上）按一下键
11.
Selection and configuration of construction machineries was the key to optimize machinery combination and realize mechanization of efficient construction.
机械设备的选型和匹配是优化机械设备合理组合、实现机械化高效施工的关键。
12.
Molecular Simulation on Mechanism of Bonding Agents in HTPB Solid Propellant Model
丁羟推进剂模型体系中键合剂作用机理的分子模拟研究
13.
glucosidic linkage
糖苷键[合],苷键[合]
14.
The Design and Development of LF-loader of LED Die-bonder;
LED键合机上料机构的设计与开发
15.
A Theoretical Study on Nuclear Spin-Spin Coupling Constants of C-X (X=H,C) Bonds
C-H键和C-C键核自旋偶合常数的理论研究
16.
A set of keys, as on a computer terminal, word processor, typewriter, or piano
键盘一系列键，如计算机终端设备、文字处理机、打字机或钢琴上
17.
The feeder mechanism of a die bonder and its virtual prototype
芯片键合机传送机构及其虚拟样机研究
18.
An organic compound containing many double bonds.
多烯一种包含许多双键的有机化合物