1.
Strain-stress Behavior and Microstructure of Cu-Ag Filamentary Microcomposites;
纤维复合Cu-Ag合金组织与应力—应变行为
2.
Microstructure and Electrical Conductivity of Cu-Ag Filamentary Microcomposites;
纤维复合Cu-Ag合金组织与导电性能的关系
3.
Evolution and Effect of Crystallographic Texture in Cu-Ag Filamentary Microcomposites;
纤维相强化Cu-Ag合金的织构分布及作用
4.
Active Brazing AlN Ceramic and Mo-Cu Alloy Using Ag-Cu-Ti
Ag-Cu-Ti活性法封接AlN陶瓷与Mo-Cu合金
5.
Rapid Solidification of Ag-Cu-Sb Ternary Eutectic Alloy;
Ag-Cu-Sb三元共晶合金的快速凝固研究
6.
Study on Cu-Ag-Si-Ga Series Brazing Filler Alloys with Low Vapour Pressure
Cu-Ag-Si-Ga系低蒸气压钎料合金研究
7.
A Study on the Active Brazing of AlN to W-Cu Alloy with Ag-Ti_4 Active Filler Alloy
Ag-Ti_4活性钎料钎焊AlN与W-Cu合金研究
8.
Effects of Ag on Microstructure and Properties of Al-Cu-Mg Alloy
Ag对Al-Cu-Mg合金组织与性能的影响
9.
Effects of Trace Ce on the Properties of Cu-Ag-Cr Alloy
微量Ce对Cu-Ag-Cr合金性能的影响
10.
Prestretching and Heat Treatment Process of Al-Cu-Mg-Ag Alloy
Al-Cu-Mg-Ag合金形变热处理工艺研究
11.
Brazing of C_f/SiC composite to Ti alloy using Ag-Cu-Ti-TiC composite filler materials
C_f/SiC复合材料与Ti合金的Ag-Cu-Ti-TiC复合钎焊
12.
Microstructure Evolution and Strengthening Mechanism in Cu-6%Ag Filamentary Composites
双相纤维复合Cu-6%Ag合金组织演化及强化机制
13.
Electron Microscopy Study of Crystallization in Melt-Spun Zr-Al-Ni-Cu-Ag Amorphous Alloys;
Zr-Al-Ni-Cu-Ag非晶合金晶化的电子显微研究
14.
Rapid Crystal Growth of Ag-Cu-Ge Ternary Eutectic Alloy;
三元Ag-Cu-Ge共晶合金的快速晶体生长研究
15.
Electron Microscopy Investigation of Precipitates in Al-Cu-Mg-Ag(-Ce) Alloys;
Al-Cu-Mg-Ag（-Ce）合金析出相的电子显微研究
16.
Study on Production of Free-Lead Solder Alloy and Solder Alloy Fine Powder of Sn-Ag-Cu System;
Sn-Ag-Cu系无铅焊锡合金及其微粉制备技术研究
17.
Study on Cu/Ag Alloy Film Used for CdZnTe Detector Electrode;
Cu/Ag合金薄膜用作CdZnTe探测器电极的研究
18.
Research on Properties of Sn-Ag-Cu Solder Alloy Doped with Sb;
掺杂Sb的Sn-Ag-Cu系焊料合金性能的研究