1.
Absorption Equations and Interval Q Inversion of Reflection Waves from CMP Gather
CMP道集反射波吸收方程和层Q值反演
2.
Nickel chemical mechanical polishing
纳米集成电路中镍基CMP工艺(英文)
3.
Preparation of Ceria-Based Polishing Powders and Its Application in CMP;
铈基抛光粉的制备及其在CMP中的应用
4.
Study on CMP Slurry of ULSI Copper Interconnection Layer;
ULSI铜互连层CMP抛光液研究
5.
Study on CMP Technology of Single Crystal MgO Substrates for High Temperature Superconductors;
单晶MgO高温超导基片CMP工艺的研究
6.
Study on CMP Slurry Prescription of SiO_2 ILD;
二氧化硅介质层CMP抛光液配方研究
7.
The Design and Development of Three-station CMP Control System;
三工位CMP控制系统的设计与开发
8.
A Simulant Experiment Study of the Silicon s Mechanism in the CMP;
单晶硅片CMP磨损机理的模拟试验研究
9.
Numerical Simulation of Slurry Film Lubrication in Chemical Mechanical Polishing Process;
CMP过程中抛光液流场数值仿真研究
10.
3IC Application in DSTI-CMP Process
3IC在DSTI-CMP工艺中的应用与研究
11.
Effect of pH on Roughness of InSb in CMP
CMP中酸碱度对InSb晶片粗糙度的影响
12.
Study on the Removal Rate of CMP for Tungsten Plug in ULSI
ULSI多层互连中W-CMP速率研究
13.
Optimized Methods for Preventing the Overlarge Wave Motion of CMP Load Based on GCP
基于GCP防CMP负荷大幅波动的优化方法
14.
High-efficiency and Low-damage Chemical Mechanical Polishing Process of CdZnTe Crystals
碲锌镉晶体高效低损伤CMP工艺研究
15.
Study on Measurement and Evaluation of Post-CMP
CMP后的晶圆的测量和评估方法研究
16.
Thermal Simulation and Key Technologies of Chemical Mechanical Planarization (CMP) for Phase Change Memory;
相变存储单元热模拟及其CMP关键技术研究
17.
Study on CMP Nano-Slurry and Technology;
CMP纳米抛光液及抛光工艺相关技术研究
18.
Study on the Effects of the Surface Texture and Constituent of the Pad in CMP;
抛光垫表面构造和组织对CMP影响效果的研究