1.
Adsorption and Desorption of Nitrogen Molecules on the Copper Single Crystal Surface of Cu(Ⅲ);
氮分子在铜单晶表面Cu（Ⅲ）上的吸附—脱附
2.
Molecular Dynamics Simulation of Subsurface Deformed Layers in Nanometric Cutting Using Atomic Force Microscope Pin Tool
单晶铜原子力显微镜加工过程亚表面变形层的分子动力学仿真
3.
The Microstructure and Mechanical Property of Lead-free Solder/copper Single Crystal Interface;
铜单晶体/无铅焊料的界面组织与性能
4.
Microstructure of Surface Recrystallization of Single Crystal Superalloy DD6
单晶高温合金DD6表面再结晶组织
5.
Surface, Interface and Dislocation Behaviors of CdZnTe Single Crystals;
CdZnTe单晶表面、界面及位错的研究
6.
Material Features and Cladding Technology for Crystallizer Copperplate of Slab Caster
板坯连铸机结晶器铜板材质及表面镀层技术
7.
Thermal Spraying Technology of Surface Coatings of the Continuous Casting Mould
连铸结晶器铜板表面涂层热喷涂技术研究
8.
Preparation of SiC Whiskers Pre-added Ni-based Cladding on Cu Alloy Surface by Laser Deposition
铜合金表面添加SiC晶须的Ni-Cu激光熔覆层
9.
Self-Assembled Monolayers on Gold, Platinum and Copper Single Crystal Surface: ECSTM and Molecular Simulation Study;
金、铂、铜单晶面上自组装单层膜的ECSTM与分子模拟研究
10.
STUDY ON PRODUCING PURE COPPER SINGLE CRYSTAL INGOT BY CONTINUOUS CASTING OF SINGLE CRYSTAL METALS(CCSC);
单晶连铸法制备铜单晶体的试验研究
11.
Study on High Quality Surface Protection of Single Crystal MgO Polishing Substrate;
单晶MgO抛光基片高质量表面保护研究
12.
Surface Quality Study of Sapphire Crystal Grinded by Electrolytic In-Process Dressing (ELID) Method;
蓝宝石单晶ELID磨削表面质量研究
13.
Reflection of the Incidence O-Ray on the Internal Boundary Surface of Uniaxial Crystal;
单轴晶体内表面入射o光线的双反射
14.
Molecular Simulation Study of Self-Assembled Monolayers on Copper Surface;
铜表面自组装单分子膜的分子模拟研究
15.
Synthesis of copper nanoparticles surface-modified with self-assembled monolayers
单分子层表面修饰铜纳米颗粒的制备方法
16.
Characteristics of a biosurfactant produced by Pseudomonas aeruginosa S6
铜绿假单胞菌S6分泌的生物表面活性剂特性
17.
And the concave-convex deformation of grains surface occurred in the early stage of fatigue in copper.
疲劳初期,纯铜试样表面还出现晶粒的弹性凹凸变形。
18.
Study on the Surface Layer Damage of Monocrystalline Silicon Wafer Induced by Ultra-precision Grinding;
单晶硅片超精密磨削加工表面层损伤的研究