1.
Investigation on Cyanide-free Alkaline Copper Electroplating and Eletrochemical Behavior
无氰碱性镀铜工艺及其电化学过程的研究
2.
Investigation on Anticarbonized Bright Copper-plating Process in Basic Cyanide Baths
碱性氰化物防渗碳光亮镀铜工艺的研究
3.
Study on Plating 22K Au-Cu Alloy in Cyanide Free Bath;
无氰电镀22K金—铜合金工艺研究
4.
Cyanide-free copper electroplating in sulfite/thiosulfate bath
亚硫酸盐/硫代硫酸盐体系无氰镀铜
5.
Advances in experimental study and production practice of cyanide-free copper plating--Part Ⅱ
无氰镀铜的实验研究与生产应用进展(二)
6.
Process for Cyanide-Free Copper Electroplating of Aluminum Alloy and Its Application on Automobile Wheels Made of Aluminum Alloy
无氰高密度镀铜工艺及其在汽车轮毂中的应用
7.
Advances in experimental study and production practice of cyanide-free copper plating-Part I
无氰镀铜的实验研究与生产应用进展(一)
8.
The study of electrochemical behaviors for a citrate alkaline copper plating bath
柠檬酸盐碱性镀铜的电化学行为研究
9.
Copper Electroplating in Alkaline Bath Containing Novel Brightening Agent
采用新型组合光亮剂的碱性镀铜研究
10.
Microstructure and Properties of Cyanide-Fret Pulse-Plated Galvanizing Coating on AZ31B Magnesium Alloy
AZ31B镁合金无氰脉冲镀锌层的结构与性能
11.
Zinc base die castings are always copper plated in cyanide baths.
锌基合金的压铸件总是在氰化镀液中镀铜。
12.
Safeguard of Solution and influence of Impurities for Non- Cyaniding Silver Electroplating
无氰镀银溶液的维护及杂质对镀层质量的影响
13.
Study on Additives in Gold electroplating for a Cyanide-free Bath
一种新型无氰镀金配体及添加剂研究
14.
Study on Cyanide-free Eletroless Nickel Plating Process on AZ91D Magnesium Alloy
AZ91D镁合金无氰浸锌化学镀镍的研究
15.
Study on the Process of Cu-Sn-Zn Cyanide-free Gold Imitation Plating
Cu-Sn-Zn三元无氰仿金电镀工艺研究
16.
The adhesive strength of the acid film was stronger than that of the alkali film.
碱性镀层的结合强度优越于酸性镀层。
17.
Study on bis-Furaldhyde Schiff Base Cupper( II) Metallic Complex as Carriers for the Preparation of Highly Selective Thiocyanate Electrode;
双呋喃甲醛Schiff碱金属铜(Ⅱ)配合物为载体的高选择性硫氰酸根离子电极
18.
On the SCN -Ion Selective Electrode with Carrier of Complex of Unsymmetrical Schiff Base with Cu(Ⅱ)
以不对称席夫碱金属铜(Ⅱ)配合物为载体的硫氰酸根离子选择性电极