1.
" Plastics-Test methods of exposure to damp heat,steady state"
GB/T12000-1989塑料在恒定湿热条件下曝露试验方法
2.
STUDY ON THE HYGROTHERMAL AGING RULE OF PERSPEX
有机玻璃在湿热条件下老化规律的研究
3.
The Mechanical Properties of Bamboo Reinforced Poplar Laminated Veneer Lumber(LVL) after Hot-moisture Treatment;
湿热条件下竹材增强单板层积材力学性能的研究
4.
ANALYSIS OF POSTBUCKLING AND DELAMINATION GROWTH FOR DELAMINATED PIEZOELECTRIC LAMINATED BEAMS UNDER HYGROTHERMAL CONDITIONS
湿热条件下具脱层压电层合梁的后屈曲及脱层扩展分析
5.
Environmental condition for machinery products Warm-damp
GB/T14092.1-1993机械产品环境条件湿热
6.
Specification for damp heat test chambers
GB/T10586-1989湿热试验箱技术条件
7.
This suggests that the optimum for biological weathering would be in a hot, most climate.
这表明生物风化最适宜的条件是湿热气候。
8.
Characteristic of Heat and Mass Transfer of Falling Film Under Moist Air Sweeping Condition
湿空气吹扫条件下降膜流动传热传质特性
9.
Coupled Heat and Moisture Transfer in Multi-wall Under Periodic Boundary Conditions
周期性边界条件下多层墙体内热湿耦合迁移
10.
Study on the Tensile Property of PVC Membrane Structure Material in Thermal and Hygrothermal Conditions
热湿条件对PVC膜结构材料拉伸性能的影响
11.
The main fectors influencing the heat-humidity transferconditions and air distribution are the climatic conditions out of thecourtyard, the heat and humidity genereted within the yard.
影响庭院内热湿状况和空气环境药因素有院外气象条件，院内发热和产湿量。
12.
Requirements of damp-heat testing of electrical machine for service in general environmental condition
GB/T12665-1990电机在一般环境条件下使用的湿热试验要求
13.
General specification for damp heat protective packaging of machinery products
GB/T13126-1991机械工业产品湿热带防护包装通用技术条件
14.
Coupled model of moisture and heat reaction during soil freezing and thawing under environmental climate condition
环境气候条件下土壤冻融过程中湿热耦合作用模型研究
15.
glass-reinforced thermosetting plastics(grp) pipes-determination of the creep factor under wet conditions and calculation of the longterm specific ring stiffness
玻璃增强热固性塑料管-潮湿条件下蠕变因子的测定和特定环状物的硬挺度计算
16.
Changes on Mechanical Parameters of Collapsible Loess in Humidifying Terms
浅谈湿陷性黄土在增湿条件下的力学参数变化
17.
Analysis of thermal stress and hygrothermal stress for SiP device in reflow soldering
SiP器件回流焊时湿热应力的分析
18.
produced under conditions involving intense heat.
在高热量条件下产生。