1.
upside-down mounting
倒装法 -集成电路组装的
2.
We'll have to finish the jog, however long it takes.
注意：这里是表语倒装和宾语倒装，主要动词没有倒装。
3.
Electromigration in Sn3.0Ag0.5Cu flip chip solder joint
Sn3.0Ag0.5Cu倒装焊点中的电迁移
4.
An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术
5.
Flip Chip will be a New Method of Packaging Technology
倒装芯片将成为封装技术的最新手段
6.
Bumping Technology for MEMS Flip Chip Packaging;
MEMS封装中的倒装芯片凸点技术
7.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
8.
The technique of reversing, or inverting the normal word order of a sentence.
倒装句：一种将句子正常的表达方法倒置的技巧。
9.
A change in normal word order, such as the placement of a verb before its subject.
倒装正常词序的变化，例如，倒装动词置于主语之前
10.
Installing Roof Antenna Mast of High-rise Building by Upside-down Lifting Method
倒装吊升法安装高层建筑屋顶天线桅杆
11.
Progress of Anisotropic Conductive Adhesive for Flip Chip Packaging
倒装芯片封装材料—各向异性导电胶的研究进展
12.
Study of the Process of the Flip Chip Package Based on Aluminum Nitride Substrate
以氮化铝陶瓷为基板的倒装式封装工艺研究
13.
Thermal Performance Research on Electronics Packaging Component Based on Flip Bonding;
基于倒装焊接的电子封装器件热性能的研究
14.
Thermal Power Plant FGD Absorber Flip Construction Technology
火力发电厂烟气脱硫装置吸收塔倒装施工工艺
15.
The challenger took a dive.
挑战者假装被击倒.
16.
a knockout feigned by prearrangement between prizefighters
"职业拳击手事先安排的假装被击倒,佯倒."
17.
He' s not really angry he' s just acting ( the stern father ).
他倒不是真生气--只是装装（严父的）样子罢了.
18.
A Research on the Alarm Unit for Backing a truck of the Container Reach Stacker and Its Application
集装箱正面吊倒车报警装置的研究与应用