1.
film mounted ic
膜载组装的集成电路
2.
upside-down mounting
倒装法 -集成电路组装的
3.
hybrid microassembly
混合集成电路微组装
4.
IC's have become the basic "modules from which digital circuits are constructed.
集成电路就成了数字电路的组成模块。
5.
circuit, integrated hybrid, thin or thick film
混合集成电路,薄膜或厚膜的
6.
POPCLU = populated cluster routing (member routing possible)
POPCLU=组装的群集路由（可能的成员路由）
7.
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
8.
passive hybrid film integrated circuit
无源混合膜集成电路
9.
Generic specification for film integrated circuits and hybrid film integrated circuits
GB/T8976-1996膜集成电路和混合膜集成电路总规范
10.
Important Technique Problems in Silk Screen Printing for Thick Film Integrated Circuits
厚膜集成电路网印应注意的技术问题
11.
integrated circuit distance relay device
集成电路距离保护装置
12.
in line ic processor
吝式集成电路加工装置
13.
These were circuits on single chips with up to ten components on them, small-scale integration (SSI).
其实就是在一块单独的芯片上安装了有十来个组件构成的电路，即小型集成电路（SSI）。
14.
The process of incorporating separate items to form a single unit or structure;for example, the incorporation of a large number of transistors into an" integrated" circuit.
将单个元件组装成一台设备或一种结构的过程。例如，将大量的晶体管组成一个“集成”电路。
15.
A welding technology used for assembling an integrated circuit.
装配集成电路的一种焊接工艺。
16.
Case outlines for film integrated circuits and hybrid integrated circuits
GB/T15138-1994膜集成电路和混合集成电路外形尺寸
17.
large scale compound integration
大规模组合集成电路
18.
a metal mounting for the circuit components of an electronic device.
电子设备中的电路组成部分的金属片承载物。