1.
Three-dimensional Microfabrication on GaAs by Using Regular Patterns Molds by the Confined Etchant Layer Technique;
约束刻蚀剂层技术用于砷化镓三维规整细微图形的复制加工
2.
Electrochemical Micromachining on Different Types of GaAs by Confined Etchant Layer Technique
不同类型GaAs上应用约束刻蚀剂层技术进行电化学微加工
3.
The feasibility of Confined Etchant Layer Technique(CELT) has been studied.
本文对用于三维超出图形复制加工的约束刻蚀剂层技术进行了可行性研究。
4.
Study on Complex 3-Dimensional Microstructure Machining on Metal Surface by Confined Etchant Layer Technique;
约束刻蚀剂层技术（CELT）用于金属材料表面复杂三维微结构的加工研究
5.
APPLICATION OF ION BEAM MILLING TECHNIQUE TO JOSEPHSON DEVICE TECHNOLOGY
离子束刻蚀技术在约瑟夫逊器件工艺中的应用
6.
Generic specification of ion beam etching system
GB/T15861-1995离子束蚀刻机通用技术条件
7.
Electron-beam lithography with a novel multilevel resist structure defines the pattern.
采用新型的多层抗蚀剂结构的电子束光刻来形成图形。
8.
The Study of FSG Etching in No-stop-layer Dual Damascene Structure;
无中间层双大马士革中FSG刻蚀技术的研究
9.
Research and Application of Near-surface Model Constrained Tomographic Static Correction Technique
近地表模型约束层析静校正技术研究与应用
10.
Research on Piezoelectric Damping Technology in Structural Vibration Control: (3)Smart Constrained Layer Damping Technology
结构振动控制中压电阻尼技术研究（三）机敏约束层阻尼技术
11.
Application of pre-stack constrained stratigraphic inversion technique in reservoir prediction of glutenite
叠前道集地层约束反演技术在砂砾岩储层预测中的应用
12.
SUMT (Sequential Unconstrained Minimization Technique)
顺序无约束极小化技术
13.
Study on Wet-etching of PZT Thin Films on Silicon Substrate
硅基PZT热释电薄膜湿法刻蚀技术研究
14.
Optimization on gate-recessed AlGaN/GaN HEMT with low damage etching technique
AlGaN/GaN HEMT栅槽低损伤刻蚀技术
15.
Focused Ion Beam Milling of Photonic Crystals in Bulk Silicon
FIB技术在硅基上刻蚀光子晶体的研究
16.
The most prevalent procedure is to use photolithography or electron-beam lithography to produce a pattern in a layer of photoresist on the surface of a silicon wafer.
最常用的步骤是用光蚀刻或电子束蚀刻法，在矽晶圆表面的光阻层上制作出图案。
17.
The art of preparing etched plates, especially metal plates, from which designs and pictures are printed.
蚀刻蚀刻工艺，特指用金属版印制图样或图画的技术
18.
A Real-Time Scheduling Algorithm of Wet-Etching System with Residency Constraints in Semiconductor Wafer Fabrications
基于驻留约束的半导体晶圆蚀刻系统实时调度算法