1.
Analysis on the Relation between EMC Property and Packaging Defect
浅析环氧塑封料性能与器件封装缺陷
2.
Study of Some Problems in Environmental Friendly Improvement of Epoxy Molding Compounds
环氧塑封料绿色环保化过程中的问题研究
3.
Preparation and Properties of Epoxy Electronic Encapsulating Materials with High Thermal Conductivity and Low Thermal Expansion Coefficient;
高导热低膨胀环氧塑封料的制备及性能研究
4.
Nitto Denko Semiconductor Related Epoxy Molding Compound Strategic Analysis of China Market;
日东电工半导体用环氧树脂塑封料中国市场策略研究
5.
Application of Silicone to Epoxy Encapsulating Materals and Potting Compound
有机硅在环氧包封料、灌封料中的应用
6.
Synthesis of Hexaphenylamine Cyclotriphosphazene Flame Retardant and Its Application in Epoxy Molding Compound for Large-scale Integrated Circuit Packaging
六苯胺环三磷腈的制备及其对大规模集成电路封装用环氧模塑料的无卤阻燃
7.
Preparation and Properties Study on Encapsulating Materials of Epoxy Resin;
环氧树脂灌封材料的制备与性能研究
8.
Can strips of plastic Be united with epoxy?
塑料带可以用环氧树脂黏合起来吗?
9.
Influence of Waxes on the Properties of EMC
脱模剂对环氧模塑料性能影响的研究
10.
Study on the curing reaction kinetics of epoxy electrician molding compound
环氧电工塑料的固化反应动力学研究
11.
The Study and Preparation of Environmental and Special SEBS Thermoplastic Elastomer Compound for Sealing;
环保型SEBS热塑性弹性体密封条专用料的研制
12.
The influence of filler on the properties of epoxy encapsulating materials
硅微粉填料对环氧灌封材料性能的影响
13.
Research on Materials System and Molding Technology of Epoxy Molding Compounds with High Thermal Conductivity;
高导热环氧模塑料材料体系及成型工艺研究
14.
DEVELOPMENT OF EPOXY/EPOXY-SILSESQUIOXANE HYBRID MATERIAL FOR LED PACKAGING
LED封装用环氧树脂/环氧倍半硅氧烷杂化材料的研制
15.
automatic plastic bag film seaming and cutting machine
塑料薄膜袋自动封剪机
16.
ties for sealing plastic bags
封塑料袋用的捆扎条.
17.
plastic film continuous sealing machine
塑料薄膜连续封口机
18.
Preparation and Characterization of Lightweight and Higher Resistance to Impact Epoxy Encapsulating Materials
轻质抗冲击环氧灌封材料的制备与表征