1.
Design of welding pressure control system for ultrasonic gold wire bonding machine
超声波金丝球焊线机焊接压力控制系统设计
2.
Research on the Visual Matching Algorighm of Automatic Wirebonder;
金丝球焊机快速视觉匹配算法的研究
3.
The design of fire-fighting system for gold wire bonder
面向金丝球焊线机的打火烧球控制系统设计
4.
New Globe-tube Soldering Techoology of Soldering Hollow Globe-Net-Shelf Struct ure;
焊接空心球网架结构球—管焊接新工艺
5.
The necessarily of post-weld heat treatment of spherical tanks was emphasized.
强调了焊接球罐焊后热处理的必要性。
6.
Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages
再成形(Re-Balled)焊球阵列封装的焊球强度评估
7.
Influence of Spheroidization Temperature on Quality of BGA Solder Ball
球化温度对BGA钎焊球质量的影响
8.
The Numerical Simulation of Weldind Defect and Welding Residual Stresses in the Spherical Tank;
球罐焊缝缺陷与焊接残余应力的数值模拟
9.
Analysis for the Welded Empty Sphere Joint with Incompletely Filled Groove Defect;
含未焊透缺陷网架焊接空心球节点应力分析
10.
Assessing the safety of fully welded body pipeline ball valve
全焊接阀体管线球阀焊接接头的安全评估
11.
Research on flexible rail type spherical tank welding robot
用于球罐焊接的柔性导轨焊接机器人研究
12.
Pb-free solders– Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、发，焊料（球、膏）发等。
13.
Pb-free solders ? Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、开发，焊料（锡球、锡膏）开发等。
14.
Influence of Spheroidization Temperature on Real Sphericity and Surface Quality of BGA Solder Ball
球化温度对BGA钎焊球真球度及表面质量的影响
15.
Research of automatic tracing on tr ack type sphere welding machine
轨道式球罐焊机自动跟踪方法的研究
16.
Study on the Microelectronic Solder Balls Preparation Method;
微电子BGA 焊球制备方法的研究
17.
Welding Technique of 610U2L steel Used for Ethylene Spherical Tank
610U2L钢制乙烯球罐的焊接技术措施
18.
Analysis and Patching for Cracks which Appeared after the 2000m~3 Spherical Tank Assembling Weld
2000m~3球罐组焊裂纹分析与修补