1.
ceramic dual in-line package
陶瓷双列直插式封装
2.
cerdip assembly
陶瓷双列直插式外壳组装
3.
Packages canbe plastic, ceramic, Cer-DIP, or other type.
封装类型可以是塑料型、陶瓷型、陶瓷双列直插型或其它类型。
4.
Packages canbe plastic, ceramic, Cer- DIP, or other type.
封装类型可以是塑料型、瓷型、瓷双列直插型或其它类型。
5.
dual in line integrated circuit
双列直插式集成电路
6.
plastic dual in line package
塑料双列直插式外壳
7.
dip rotoary switch
双列直插式旋转开关
8.
dual in line lead frame
双列直插式引线框架
9.
Electromechanical switches for use in electronic equipments--Part 3: Sectional specification for in-line package switches
GB/T15461-1995电子设备用机电开关第3部分:成列直插封装式开关分规范
10.
Study of the Process of the Flip Chip Package Based on Aluminum Nitride Substrate
以氮化铝陶瓷为基板的倒装式封装工艺研究
11.
dip integrated circuit
双列直插式外壳集成电路
12.
Study on Antibullet Performance of Metal-ceramic Composite Armor
金属封装陶瓷复合装甲抗弹性能研究
13.
The generator represents magnetron, packaged with constant magnets in ceramic-metal execution.
该磁控管采用金属陶瓷封装，装有永磁体。
14.
quad flat package
四列直插式扁平外壳
15.
The generator represents magnetron, packaged with constants and electromagnets(2 coils magnetic) in the magnetic-shielded ceramic-metal execution.
该磁控管的设计采用电磁石，封装采用金属陶瓷。
16.
Studies on the Integrated Ceramic Membrane Emulsification Apparatus and Its Applications;
一体式陶瓷膜乳化装置的研究和应用
17.
paste-on-paste pate-surpate
(陶瓷装饰) (法) 堆花
18.
Specification of DIP lead frames produced by etching
GB/T15877-1995蚀刻型双列封装引线框架规范