1.
Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
GB/T16317-1996多层印制电路用限定燃烧性的薄覆铜箔聚酰亚胺玻璃布层压板
2.
interlayer contact
层间接触-印制电路板的
3.
interlayer continuity
层间连接-印制电路板的
4.
copper foil laminate
铜箔叠层板-印制电路板的
5.
multilayer and high density fine-pitch printed circuit board
多层和高密度细线距的印刷电路板；多层和高密度细线距的线路板
6.
Test method for insulation resistance within inner layers of multilayer printed boards
GB/T4677.17-1988多层印制板内层绝缘电阻测试方法
7.
Test method for insulation resistance between layers of multilayer printed boards
GB/T4677.18-1988多层印制板层间绝缘电阻测试方法
8.
Making Multi-purpose Printed Circuit Board by Oneself for Desigming and Making Circuit;
自制多用印刷线路板进行电路设计与制作
9.
Low Cost Printed Flexible Multilayer Substrates
多层柔性衬底电路板的低成本丝网印刷
10.
sequentially-laminated mulitlayer
顺序层压多层印制板
11.
Phenolic cellulose paper copper-clad laminated sheets for printed circuits
GB/T4723-1992印制电路用覆铜箔酚醛纸层压板
12.
General rules for copper-clad laminated sheets for printed circuits
GB/T4721-1992印制电路用覆铜箔层压板通用规则
13.
Epoxide cellulose paper copper-clad laminated sheets for printed circuits
GB/T4724-1992印制电路用覆铜箔环氧纸层压板
14.
Test methods for copper-clad laminated sheets for printed circuits
GB/T4722-1992印制电路用覆铜箔层压板试验方法
15.
Epoxide woven glass fabric copper-clad laminated sheets for printed circuits
GB/T4725-1992印制电路用覆铜箔环氧玻璃布层压板
16.
Study on the Processing Technology of the Step Designed Planar Buried Resistant Microwave Multilayer Printed Circuit Board
埋电阻台阶式多层微波印制板制造技术研究
17.
EXPERIMENTAL RESEARCH ON THE TREATMENT OF COPPER-CONTAINING WASTEWATER FROM PRINTED CIRCUIT BOARD FACTORIES
多法联合处理印制电路板生产厂含铜废水
18.
Job Shop Printed Circuit Board Assembly Optimization Based on Model Constrainted by Polychromatic Sets
基于多色集合约束模型的车间层印刷电路板组装优化