1.
Flexible Bumping Technology and Applications in MEMS Flip Chip Packaging;
MEMS器件倒装芯片封装中的柔性化凸点制备技术及其应用
2.
triangular asperities technique
三角形凸点密封技术
3.
The Study of Pulse Electroplating of Au-Sn Bumps
脉冲电镀法制备Au-Sn凸点的研究
4.
Investigation of Electromigration on Lead-Free Solder Bump in Flip Chip Packaging
倒装芯片技术中无铅凸点电迁移研究
5.
Bumping Technology for MEMS Flip Chip Packaging;
MEMS封装中的倒装芯片凸点技术
6.
Progresses of National Ignition Facility target
国家点火装置(NIF)点火靶制备技术研究进展
7.
Research on the Control Technology of Middle-convex and Varying Ellipse Piston Turning;
中凸变椭圆活塞车削控制技术的研究
8.
The Study of Sequential Electroplating Au/Sn Bumps for FC-LEDs;
分步电镀法制备FC-LEDs用Au/Sn凸点的研究
9.
The Research on a Low Cost Flip Chip Bumping Process by Stencil Printing
一种低成本倒装芯片用印刷凸焊点技术的研究
10.
The Application of Tangential Point Tracing Grinding and Other Key Technologies in Camshaft Grinding;
切点跟踪及其关键技术在凸轮轴磨削中的应用
11.
Semiconductor Quantun Dot and Quantum Wire Materials and Their Fabrication Technology
半导体量子点和量子线材料及其制备技术
12.
Controllable Synthesis of Ordered ZnO Nanodots Arrays by Nanosphere Lithography;
用纳米球类光刻技术可控制备ZnO纳米点的研究
13.
The Application of Three-dimension Macroporous TiO_2 in Biosensor
静电纺丝技术制备ZnS量子点掺杂TiO_2纤维
14.
The Characteristics and Applicability of ERCO-R ClO_2 Generation Technologies
ERCO-R系列二氧化氯制备技术的特点及适用性
15.
SELECTION OF HOT STRIP SHAPE AND CROWN CONTROL TECHNOLOGY
热轧带钢及板形和凸度控制技术的选择
16.
The Application of Virtual Manufacturing in the Production of a Camshaft;
虚拟制造技术在凸轮轴模具加工中的应用
17.
The Research on Electrochemical Mechanical Finishing Technology on Cam Surface and Its Control System;
凸轮电化学机械光整加工技术及控制系统研究
18.
Key Technologies of the Control System of Camshafts Grinding Process with High Speed;
凸轮轴高速磨削加工控制系统关键技术