1.
Good sealing,optimum for high speed packing machine.
热封性能优良，适用于高速包装设备。
2.
Sealing Material and Anti-acid-corrosion Properties of the Thermal Spraying Coating
热喷涂涂层封孔材料及其耐酸蚀性能
3.
Study on High-Strength RTV Silicone Sealant
高强度有机硅密封剂的耐热性能研究
4.
MECHANICAL PROPERTY EXPERIMENT OF THERMAL HORIZONTAL WELL EXTERNAL PACKER ELEMENT MATERIAL AT HIGH TEMPERATURE
热采水平井管外封隔器封隔材料高温力学性能试验
5.
The Analysis and Simulation of Temperature Field and Stress Field in an Oil Slurry Heat Exchanger;
油浆蒸汽发生器热应力计算及密封性能研究
6.
Thermophysical Properties of Aluminum Infiltrated Silicon Carbide for Electronic Packaging;
铝渗碳化硅电子封装材料的热物理性能
7.
Research on the Influencing Factors on the Structure Performance of Heating BOPP Film;
热封型BOPP薄膜结构性能及其影响因素的研究
8.
Experimental Investigation on the Performance of Devices for Heat Dispersing of Chips and Enclosure;
芯片及密封机柜散热装置的性能实验研究
9.
Preparation and Properties of Epoxy Electronic Encapsulating Materials with High Thermal Conductivity and Low Thermal Expansion Coefficient;
高导热低膨胀环氧塑封料的制备及性能研究
10.
Thermal Performance Research on Electronics Packaging Component Based on Flip Bonding;
基于倒装焊接的电子封装器件热性能的研究
11.
Study on Preparation and Performance of Aluminum Substrate for Heat Dissipation of High-power LED
大功率LED封装用散热铝基板的制备与性能研究
12.
Effect of phenyl content on heat resistance of silicone sealant
不同苯基含量的有机硅密封剂耐热性能研究
13.
Research and Development on Thermal Conductivity of SiC/Al Composites Applied to Electronic Packaging
电子封装SiC_p/Al复合材料导热性能研究与进展
14.
Effect of vulcanizing agent on heat resistance of silicone sealant
硫化剂对有机硅密封剂耐热性能的影响
15.
Research on Anti-fogging and Other Properties of Heat-unseal BOPP;
非热封型防雾滴膜防雾性能及其他使用性能的研究
16.
Abstract: A high density packaging with superior thermal con duction and electrical performance, in which metal served as substrate or package, is introduced in this paper.
文摘:以金属为外壳的封装是一种新的高密度封装技术，具有优异的导热性能及电性能。
17.
THE EFFECT OF THERMO-OXIDIZING AND SHEAR STABILITIES OF LINKED POLYMER SOLUTION ON ITS PLUGGING EFFICIENCY
交联聚合物溶液的热氧化及剪切安定性对其封堵性能的影响
18.
Experimental Research on Solder's High Temperature Mechanical Property and Thermal Cycle Numeric Simulation of Solder Joints in Electronic Package;
电子封装焊料高温力学性能实验及焊点热循环数值模拟研究