1.
Effects of isothermal aging and joint size on the strength of Sn-3.0Ag-0.5Cu microscale solder joints
热时效和焊点尺寸对SnAgCu微焊点强度的影响
2.
Study of Flux for Microelectronics Soldering and Microstructure of Solder Joint;
微电子焊接助焊剂及其焊点组织研究
3.
Effect of Stand-off Height on Microstructure and Tensile Strength of Solder Joints
焊点高度对焊点微观组织和抗拉强度的影响
4.
Electrodes Displacement Detection System in Resistance Spot Welding
电阻点焊热膨胀电极位移微机检测系统
5.
A Study on Microcontroller System and Its Reliability Design in Spot Welding;
点焊微电脑控制系统研究及可靠性设计
6.
Data Acquisition System Based on Microcontroller for Quality Information of Resistance Spot Welding;
基于微控制器的电阻点焊质量信息采集系统
7.
The Research on Reliability and Pb Contamination of Microelectronic Assembly Solder Joints;
微电子组装焊点可靠性及其铅污染问题的研究
8.
Solder Joint Shape Prediction of Microelectronics Assembly Surface Mount Component
微电子组装表贴元件焊点三维形态预测
9.
Microstructure and property of spot welded joint of ultra-high strength steel and micro-alloy steel
超高强度钢与微合金钢点焊接头的组织与性能
10.
SIZE EFFECT OF MECHANICAL BEHAVIOR OF MINIATURE SOLDER JOINT INTERCONNECTIONS IN ELECTRONIC PACKAGING
电子封装微互连焊点力学行为的尺寸效应
11.
electrode ,metal contact, for welding machines
电焊机金属接点焊条
12.
According to operating conditions of arc welding machines and the meaning of duty cycle, the monitoring system of the welding machines duty cycle with MCU is studied.
根据电弧焊的特点和焊机负载持续率对焊机使用的要求,研究了监控焊机负载持续率的微机系统。
13.
The observed friction force is the force required to break these tiny welds.
我们观察到的摩擦力，就是破坏这些细微的焊接点所需要的力。
14.
Research on Effects of Minute Amount of Rare-earth Element Ce on Properties of SnAgCu Alloy and Reliability of Soldered Joints;
微量稀土Ce对SnAgCu钎料合金性能的影响及焊点可靠性的研究
15.
Experimental Research and Reliability Analysis on Lead-free Solder Joints in Microelectronic Packaging
微电子封装中无铅焊点的实验研究与可靠性分析
16.
Electromigration Induced Brittle Creep Fracture Behavior of Lead-Free Solder Micro-Interconnections
电迁移致无铅钎料微互连焊点的脆性蠕变断裂行为
17.
The joint formed by welding.
焊接点通过焊接形成的接合点
18.
Locator Optimization for Resistance-spot-welding Fixtures
电阻点焊焊装夹具定位点的优化设计