1.
SIZE EFFECT OF MECHANICAL BEHAVIOR OF MINIATURE SOLDER JOINT INTERCONNECTIONS IN ELECTRONIC PACKAGING
电子封装微互连焊点力学行为的尺寸效应
2.
Electromigration Induced Brittle Creep Fracture Behavior of Lead-Free Solder Micro-Interconnections
电迁移致无铅钎料微互连焊点的脆性蠕变断裂行为
3.
Finite Element Simulation of Interfacial Fracture Behavior of Microscale Lead-free Interconncts and the Influence of Electromigration and Isothermal Aging
无铅微互连焊点界面断裂行为及其电迁移和热时效影响的有限元模拟
4.
Mechanism and Reliability of Lead Free Joints Fabricated by Low Temperature Ultrasonic Bonding
无铅焊点低温超声互连的机理及可靠性研究
5.
Study of Flux for Microelectronics Soldering and Microstructure of Solder Joint;
微电子焊接助焊剂及其焊点组织研究
6.
solder together by using hard solder with a high melting point.
用高熔点的焊料来连接。
7.
HDIT High Bandwidth Differential Interconnect Technology
高带宽微分互连技术
8.
Effect of Stand-off Height on Microstructure and Tensile Strength of Solder Joints
焊点高度对焊点微观组织和抗拉强度的影响
9.
Effects of isothermal aging and joint size on the strength of Sn-3.0Ag-0.5Cu microscale solder joints
热时效和焊点尺寸对SnAgCu微焊点强度的影响
10.
A resin material used in soldering electrical connections.
焊接电气连接点时使用的松香之类的助焊剂。
11.
Study of the Reliability and Related Issues of Wire Bonding for High Temperature Applications;
丝焊互连的高温可靠性和相关问题的研究
12.
Studies on Microstructure and Stress of Copper Interconnects in ULSI;
ULSI铜互连线微观结构和应力研究
13.
Design Optimization and Analysis of On-Chip Interconnect in Microprocessor;
微处理器片内互连的设计优化与分析
14.
Joining Strength and Microstructure of Sintered SiC/SiC Joints Prepared by Active Brazing Process
活性钎焊法连接碳化硅陶瓷的连接强度和微观结构
15.
Component installation of nodes connected by bolts or welding required inspection Connections after passing before welding or fastening.
构件安装采用焊接或螺栓连接的节点,需检查连接节点,合格后方能进行焊接或紧固.
16.
This paper presents a new finite element modeling technique for spot-welds of autobody in vehicle crash simulation.
对点焊连接提出了一种新的模拟技术,即不同于传统的节点对节点模拟焊接。
17.
Electrodes Displacement Detection System in Resistance Spot Welding
电阻点焊热膨胀电极位移微机检测系统
18.
A Study on Microcontroller System and Its Reliability Design in Spot Welding;
点焊微电脑控制系统研究及可靠性设计