1.
Critical Success Factors for High-Volume Wafer-level Solder Ball Placement
大规模晶圆级焊球置放关键的成功因素
2.
Challenges,Trends and Solutions for 3D Interconnects in Lithography and Wafer Level Bonding Techniques
三维互连中光刻及晶圆级键合技术的挑战、趋势和解决方案(英文)
3.
Research on the thermal stress and warpage of WLCSP device
晶圆尺寸级封装器件的热应力及翘曲变形
4.
Mechanical Test Wafer- A silicon wafer used for testing purposes.
机械测试晶圆片-用于测试的晶圆片。
5.
Ingot- A cylindrical solid made of polycrystalline or single crystal silicon from which wafers are cut.
晶锭-由多晶或单晶形成的圆柱体，晶圆片由此切割而成。
6.
Process Test Wafer- A wafer that can be used for processes as well as area cleanliness.
加工测试晶圆片-用于区域清洁过程中的晶圆片。
7.
tours Powerchip Semiconductor Corporation's twelve-inch wafer plant in ....County.
赴…县参观力晶半导体十二吋晶圆厂
8.
double-reduction bevel-spur gear
双级圆锥-圆柱齿轮减速器
9.
Theoretical Calculation and Design for Cylindrical and Conical Bent Crystal Spectrograph
圆柱面和圆锥面弯晶谱仪的理论计算及设计
10.
Virgin Test Wafer- A wafer that has not been used in manufacturing or other processes.
原始测试晶圆片-还没有用于生产或其他流程中的晶圆片。
11.
Flat- A section of the perimeter of a wafer that has been removed for wafer orientation purposes.
平边-晶圆片圆周上的一个小平面，作为晶向定位的依据。
12.
Bonded Wafers- Two silicon wafers that have been bonded together by silicon dioxide, which acts as an insulating layer.
绑定晶圆片-两个晶圆片通过二氧化硅层结合到一起，作为绝缘层。
13.
Haze - A mass concentration of surface imperfections, often giving a hazy appearance to the wafer.
雾度-晶圆片表面大量的缺陷，常常表现为晶圆片表面呈雾状。
14.
Notch- An indent on the edge of a wafer used for orientation purposes.
凹槽-晶圆片边缘上用于晶向定位的小凹槽。
15.
Minimum Mould Exit Shell Thickness of Round Blooms for Peritectic Steel Casting
包晶钢圆坯结晶器出口安全坯壳厚度的研究
16.
Remy Martin Centaure Cristal
人头马特级水晶瓶酒
17.
field-controlled transistor
激励调整晶体三级管
18.
high level transistor transistor logic
高级晶体管 晶体管逻辑电路