1.
Resolutions and Effect of Delamination on Reliability for Plastic Packaging ICs
塑封集成电路离层对可靠性的影响及解决方法
2.
Semiconductor integrated circuits--Specification for stamped lead frames of plastic DIP
GB/T14112-1993半导体集成电路塑料双列封装冲制型引线框架规范
3.
Synthesis of Hexaphenylamine Cyclotriphosphazene Flame Retardant and Its Application in Epoxy Molding Compound for Large-scale Integrated Circuit Packaging
六苯胺环三磷腈的制备及其对大规模集成电路封装用环氧模塑料的无卤阻燃
4.
Terminology of packages for semiconductor integrated circuits
GB/T14113-1993半导体集成电路封装术语
5.
Electrical Simulation Research for IC Package Via
集成电路封装基板过孔电学仿真技术研究
6.
Study on a New Al-1%Si Bonding Wire for Encapsulation of Integrate Circuit;
集成电路封装用新型Al-1%Si键合线的研制
7.
The Design of Auto-inspection System of IC Package Quality;
集成电路封装质量自动检测系统的设计
8.
The usual shapes and lengths of tin whisker in electronic integrated circuit (ECI) encapsulation industry were introduced.
介绍了电子集成电路封装行业中常见的锡须的形状及长度。
9.
Cost Management Mode and Its Application in IC Assembly and Test Enterprises;
集成电路封装测试企业成本管理模式及应用研究
10.
The Analysis and Research of Transfer Molding Technology in Micro-electronics Plastics Packages;
微电子塑封传递模塑成型技术的分析与研究
11.
silicon grid PMOS type integrated circuit
硅栅pmos集成电路
12.
Design of Integrate Circuit CAD
集成电路cad设计
13.
mos array integrated circuit
mos阵列集成电路
14.
RAC Rambus Asic Cell
Rambus集成电路单元
15.
silicon gate MOS integrated circuit
硅栅ＭＯＳ集成电路
16.
TTL digital integral-circuit
TTL数字集成电路
17.
Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits
GB/T14862-1993半导体集成电路封装结到外壳热阻测试方法
18.
The Company's primary business is IC component packaging and test and memory module assembly.
公司的主要业务是集成电路封装测试和内存模块装配。