1.
Research on Nonlinear Vibration of Contact Interface in Thermosonic Bonding Transducer System
热超声键合换能系统接触界面非线性振动研究
2.
Influence of Temperature on Alignment Accuracy in the Thermosonic Flip-chip Bonding
热超声倒装键合中温度对对准精度的影响
3.
Design for Frequency-modulated Ultrasonic Generator in Ultrasonic Bonding Field
超声键合变频式超声波发生器的设计
4.
Studies on Vibration Propagation and Performance Formation of Thermosonic Flip Chip Bonding Interface;
热超声倒装键合界面运动与界面性能的生成规律研究
5.
Research on the Key Technologies of Ultrasonic-Magnetorheological Compound Finishing;
超声波磁流变复合抛光关键技术研究
6.
Research of Ultrasonic Power Supply in Wire Bonding Based on FPGA
基于FPGA的引线键合超声电源的研究
7.
Critical Technologies Research of the Microwave-Induced Thermo-Acoustic Tomography System
微波热致超声波扫描成像系统关键技术研究
8.
Sonochemical Synthesis of Nanostructured Bi_2Te_3 Based Thermoelectric Compounds;
超声化学法合成纳米Bi_2Te_3基热电化合物
9.
Ultrasonic Bonding System Applied to the Package of Polymer Micro Parts;
应用于聚合物微器件封装的超声波键合系统
10.
Ultrasonic Fusion Bonding for Polymer Microfluidic Chips
聚合物微流控芯片超声波熔融键合技术研究
11.
Research on the Ultrasonic Bonding Method for Polymer Microfluidic Chips
聚合物微流控芯片超声波键合方法研究
12.
Design of High-frequency Ultrasonic Transducer for Wire Bonding and Research on Motion Control of Bond Head
引线键合高频超声换能器的设计和键合头运动控制研究
13.
Synthesis of MnO_2 Nanowire by Ultrasonic-assisted Hydrothermal Route
超声波辅助水热合成MnO_2纳米线
14.
Effects of Ultrasound-heating Combinatorial Treatment on Milk Quality
热-超声联合作用对牛奶品质的影响
15.
Microcosmic Mechanism and Rule of the Interfaces in Ultrasonic Bonding;
超声键合界面微结构生成机理与规律研究
16.
Several Questions in Spreading EDM Combined with Ultrasonic Machining;
推广超声—放电复合加工方法的几个关键问题
17.
Effect of Substrate Surface Smoothness on Thin Al Wire Wedge Bonding Strength
平整度对细Al丝超声引线键合强度的影响
18.
Simulation and Study of Ultrasonic Vibration Propagation in Wire Bonding System
超声振动在引线键合系统中的传播仿真与研究