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1)  tin based alloy
锡基合金
1.
The performances of lead-free plating and Sn-Pb alloy plating were contrasted, and the process formulation and operation condition of tin and tin based alloy plating and electroless plating were presented.
对比了电镀无铅镀层和Sn–Pb合金镀层的性能,给出了电镀及化学镀锡及锡基合金的工艺配方及操作条件。
2.
Gas atomizing process has been used for developing SMT purposed raw material tin based alloy soldering powder of free cleaning type soldering paste,the alloy composition and impurity component contents of which have reached US QQ SS 571E and JAP JIS Z 3282A grade standards with oxide contents meeting the standard of US Multicore Co.
采用气体雾化法研制了SMT用免清洗型软钎膏的锡基合金焊粉,其合金成分及杂质元素含量达到美国QQ-S-571E和日本JIS-Z-3282A级标准,氧化物含量达到美国Multicore公司无氧焊粉的标准,一次出粉率平均达到70%以上。
2)  Tin-based alloy
锡基合金
1.
Recent progress in studies on Tin-based alloys and their composites is reviewed.
综述锡基合金及其复合物负极材料的研究现状,概述了锂离子电池负极材料的开发历程及其发展趋势,介绍了各种锡基合金的结构、电化学性能及其主要制备方法,分析了各类锡基合金的优势及存在的问题,最后指出纳米合金复合物与三维纳米多孔集流体的组合是当前合金负极实际应用的发展方向。
2.
The recent advance of tin-based alloy as candidate anodes for secondary lithium batteries is reviewed in this paper.
介绍了锡基合金体系作锂离子电池负极的优势,指出了锡金属负极的不足,提出了采用锡基合金及其复合物是克服锡金属负极主体材料尺寸稳定问题的解决办法。
3)  tin alloy
锡基合金
1.
In this paper, surface elemental composition and the oxide film formation on the surface of electroplated tin and tin alloys and its relation to soderability have been discussed.
讨论了锡和锡基合金镀层的表面元素组成和表面氧化物的生成及其与可焊性的关系。
4)  Tin-base alloys
锡基合金
1.
25 kinds of the weldable Tin and Tin-base alloys electroplating processes in the nearest 10 years in China were rewiewed systematically and completely.
系统而又比较全面地总结了我国近10年来电镀可焊性锡及锡基合金工艺25种,并指出了每种工艺的镀液性能和镀层质量的优劣,最后提出了可焊性电镀的发展趋势。
5)  tin-based tin-antimony-copper alloy
锡基锡锑铜合金
6)  tin based alloy plating
镀锡基合金
补充资料:锡基轴承合金
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性质:也叫锡巴比特。一种具有悠久使用历史的轴承合金。含有80%~90%锡,3%~16%锑,1.5%~10%铜。其组织为在软基体(α固溶体)上分布着硬质点β相(以化合物SnSb为基的固溶体)。加入铜可以防止比重偏析。常用牌号有ZchSnSbl2-4-10、ZchSnSb11-6、ZchSnSb8-4等。这类合金具有较小的线膨胀系数,良好的导热性能、工艺性能和耐蚀性。熔融法制备、压力加工成材。主要用作汽车、拖拉机、汽轮机等机械上的高速轴承。

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