1)  lead free soldering
无铅钎焊
1.
A puzzle in lead free soldering, its outlet and application prospect;
无铅钎焊的困惑、出路和前景
2)  lead-free
无铅
1.
Effect of aging treatment on microstructure and properties of lead-free free-cutting Al-Cu alloy;
时效对无铅易切削Al-Cu合金的微观组织结构与性能的影响
2.
Study on High Grade Lead-free Glaze for Fine Porcelain;
高级日用细瓷无铅釉的研制
3)  lead free
无铅
1.
Development of lead free and ETU free vulcanization System for ECO;
无铅无乙基硫脲氯醚橡胶硫化体系的开发
2.
Study of solderable lead free tin-bismuth alloy electrodeposition;
电沉积无铅可焊性锡铋合金的研究
3.
Preparation and properties of lead free graphite conducting paste;
无铅石墨导电浆料的制备和性能
4)  leadless
无铅
1.
Based on alkali- boron- silicon system, a compound function of several alkali metals, alkaline- earth metals and admixtures is used to replace that of lead to develop environment- friendly,leadless flux for overglaze colors with low bismuth content.
在碱-硼-硅系统基础熔剂中引入外加剂,通过多种碱金属、碱土金属及外加剂等复合效应来代替铅在熔剂中的作用进而研制低铋环保型无铅熔剂。
2.
With alkali-voron-silicon as the basis and addition of alkaline earth composite fluxing agent,a kind of leadless fluxing agent is developed.
以碱-硼-硅系统为基础,加入碱土金属氧化物复合助熔剂,研制无铅釉上彩熔剂。
3.
The effect of alkaline metal oxides and fluorides on the performances of green leadless fluxing agents for overglaze colors were studied by means of orthogonal experiments.
应用正交试验法,研究了碱金属氧化物及氟化物对环保型无铅釉上彩熔剂性能的影响。
5)  Lead-free Solder
无铅钎料
1.
Study of Sn-Zn Lead-free Solder by Alloying;
Sn-Zn无铅钎料合金化改性研究
2.
Study on interface and shear behavior in lead-free solder joint;
无铅钎料焊点界面与剪切行为的研究
3.
Rare earths modified Sn-58Bi low-temperature lead-free solders;
稀土改性的Sn-58Bi低温无铅钎料
6)  lead-free electroplating
无铅电镀
参考词条
补充资料:铅-铅测年
分子式:
CAS号:

性质:238U和235U两个母体铀同位素的特性实质相同,所产生的放射性成因206,207Pb的方程可合并为(207Pb/206Pb)=[(235U/238U)](t-1)。235U/238U现在的比值是1/137.8,利用非放射性成因‘稳定’204Pb作为参考同位素,作(207Pb/204Pb)与(206Pb/204Pb)的Pb-Pb等时线,应用方程计算年龄,式中(207Pb/204Pb)和(206Pb/204Pb)0是初始比值。

说明:补充资料仅用于学习参考,请勿用于其它任何用途。