1) Cu-Zn-Sn-P alloy
Cu-Zn-Sn-P四元合金
1.
On the basis of the composition and phase analysis of Cu-Zn-Sn-P alloy grid, the way of electrochemical dissolution is taken to separate the chief metal.
针对Cu-Zn-Sn-P四元合金网废料,在分析其成分组成、物相结构的基础上,确定采用电化学溶解的方式进行主金属分离;在测定其阳极电解电位的基础上,对电解的主要参数进行了初步研究。
2.
For the Cu-Zn-Sn-P alloy grid,the electrolysis was studied.
针对Cu-Zn-Sn-P四元合金网废料,采用连续电解的方式研究了采用电化学溶解———电解沉积的工艺;研究表明可以有效提取出铜组分。
2) Cu–Zn–Sn ternary alloy
Cu–Zn–Sn三元合金
1.
Imitation gold plating can produce light lustrous deposits including Cu–Zn binary alloy and Cu–Zn–Sn ternary alloy, and has bright luster.
仿金电镀层包括Cu–Zn二元合金或Cu–Zn–Sn三元合金,色泽鲜艳。
3) Cu-Sn-P alloy
Cu-Sn-P合金
4) Cu-Cr-Sn-Zn alloy
Cu-Cr-Sn-Zn合金
1.
Ageing Behavior of Rapidly Solidified Cu-Cr-Sn-Zn Alloy;
快速凝固Cu-Cr-Sn-Zn合金的时效强化研究
2.
A model of the non-linear relationship between parameters of age processes and hardness and conductivity properties of Cu-Cr-Sn-Zn alloy is established by the artificial neural network(ANN).
利用神经网络对Cu-Cr-Sn-Zn合金时效温度和时间与硬度和导电率样本集进行学习,建立了时效强化工艺BP神经网络模型。
5) ywords:
Cu-Sn-P合金组成
6) Zn-Ni-Sn ternary alloy
Zn-Ni-Sn三元合金
1.
Electroplating Zn-Ni-Sn ternary alloy on electrolyte copper foil using alkaline salt pyrophosphate solution was investigated.
采用碱性焦磷酸盐体系在电解铜箔上电镀Zn-Ni-Sn三元合金可改善铜箔表面的综合性能。
补充资料：cu、zn-superoxide dismutase
CAS: 9054-89-1
中文名称: 过氧化物岐化酶
英文名称: Dismutase, superoxide；cu、zn-superoxide dismutase；superoxide dismutase；Dismutase,superoxide
中文名称: 过氧化物岐化酶
英文名称: Dismutase, superoxide；cu、zn-superoxide dismutase；superoxide dismutase；Dismutase,superoxide
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条