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1)  Copper film
铜薄膜
1.
Copper films were deposited on silicon (100) substrates by chemical vapor deposition (CVD) using Cu(hfac)2 as a precursor.
在自行设计、建立的MOCVD系统上,以Cu(hfac)2为反应前驱物在单晶硅上进行铜薄膜的化学气相沉积,并用AFM、SEM对铜核的成长机理进行了研究。
2.
The adhesion behavior of copper film deposited by PVD on 304 stainless steel was measured by means of indentation test.
基于薄膜 /基体界面结合强度对膜基体系的使用效果有直接影响 ,采用压痕法测定了1Cr18Ni9Ti钢基材表面物理气相沉积铜薄膜的界面结合强度 ,并通过分析界面处的受力情况 ,建立相应的数学模型计算出界面结合力。
3.
Copper films were deposited on self-assembled monolayers(SAMs) modified SiO_2 substrates by chemical vapor deposition(CVD),and then the deposited copper films were characterized and analyzed.
利用化学气相沉积(CVD)的方法在自组装单分子膜(SAMs)修饰的SiO2表面沉积铜薄膜,并对得到的铜薄膜的性质进行表征与分析。
2)  copper thin films
铜薄膜
1.
Enhanced Chemical Vapor-deposited Copper Thin Films on Self-assembled Monolayers and Related Simulations;
自组装单分子层改性硅基材上化学气相沉积铜薄膜及计算机模拟研究
3)  Copper thin film
铜薄膜
1.
Ab initio method with pseudopotentials theory based on the local density functional theory has been used to investigate the bulk Cu and six-layer copper thin film.
使用基于局域密度泛函理论的第一性原理赝势法,对6原子层厚铜薄膜中的空位进行了计算机模拟研究,计算出薄膜表面层、次表层和第三层中空位的形成能分别是0。
4)  ultra-thin Cu film
超薄铜薄膜
1.
100 nm thick Cu films were prepared on the elastic polyimide substrates and a yield stress of the ultra-thin Cu films was measured by means of high elasticity of the polyimide substrate.
超薄铜薄膜较高的屈服强度归因于小尺度材料中纳米量级的薄膜厚度和晶粒对位错运动的约束作用。
5)  extra-thin copper film
超薄铜膜
1.
The extra-thin copper film wrapped diamond nanoparticles were prepared by using electroless plating method under the condition of tin chloride sensitization and palladium chloride activation.
在氯化亚锡敏化、氯化钯活化的条件下 ,通过化学镀方法 ,成功地在纳米金刚石粉体表面制备了超薄铜膜 。
6)  MnCu film
锰铜薄膜
补充资料:醋酸铜合亚砷酸铜
分子式:Cu(CH3COO)2·3Cu(ASO2)2
CAS号:

性质:学名醋酸铜合亚砷酸铜(Copper acetoarsenit)。醋酸铜和亚砷酸铜的复盐。深绿色粉末。能溶于酸。不溶于水和醇。能水解。空气中二氧化碳作用生成亚砷酸。可由亚砷酸钠、醋酸和硫酸铜作用而制得。农药上用作杀虫剂,常与消石灰混合。并配成90%可湿性粉剂使用,以降低其药害。也可用于木材防腐。

说明:补充资料仅用于学习参考,请勿用于其它任何用途。
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