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1)  Metal plating composition
金属镀层组分
2)  metal coating
金属镀层
1.
This article is devoted to clarifying the mechanism of reactive wetting and summarizing the change of wetting force of Sn-based solder and the morphology of the interfacial structure by changing the type of alloying elements added to the solder,experimental temperature and metal coating on Cu substrate.
综述了通过改变添加的合金元素种类、温度和Cu基板上的金属镀层,Sn基钎料润湿力以及界面组织形态的变化,提出了在不同实验条件下Sn基钎料的反应润湿性能不同的观点。
3)  metal plating
金属镀层
1.
The nano CNTs-PANI metal plating compound was prepared on the electroless plating process to the nano CNTs-PANI,by taken a series of contrast experiments with Ni,Cu and Ni-Cu composite,it was revealed that the nano structure metal particle was distributed uniform,and linked stable on the surface of CNTs-PANI by observed with SEM.
利用碳纳米管-纳米管状聚苯胺复合材料,进行化学无电金属镀层。
4)  CMET Coated Metal
镀层金属
5)  coating constituent
镀层组分
6)  Metallic Electroplated Coating
金属电镀层
补充资料:贵金属精密轧制装置(昆明贵金属研究所)


贵金属精密轧制装置(昆明贵金属研究所)


嫉蘸一’瓜.峨蘸颧翼鑫黝当渊狱贵金属精“轧“装置(昆明贵金属研“所)
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
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